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Home » Product Directory » Electrical & Electronics » Circuit Board » 10 Layers with Blind and Buried Vias

10 Layers with Blind and Buried Vias

10 Layers with Blind and Buried Vias
10 Layers with Blind and Buried Vias

Product Description

Base material; FR4
Thickness; 2.5(mm)
Layer; 10 layers with blind and buried vias
Min. Hole size; 0.4mm
Thickness of copper foil in internal/external layer; 175¦Ìm
Final Finishing; HASL
Application: Mainly using for telecommunication switching system

   
Company: Shenzhen Bomin Electronic Co., Ltd.

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