10 Layers with Blind and Buried Vias
![]() 10 Layers with Blind and Buried Vias |
Product Description
Base material; FR4
Thickness; 2.5(mm)
Layer; 10 layers with blind and buried vias
Min. Hole size; 0.4mm
Thickness of copper foil in internal/external layer; 175¦Ìm
Final Finishing; HASL
Application: Mainly using for telecommunication switching system
| Company: | Shenzhen Bomin Electronic Co., Ltd. |
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