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Home » Product Directory » Instruments & Meters » Analysis Instrument » Laboratory Hot Plate With Copper Plate and Max Temperature 600 Celsius Degree and Nitrogen Purge

Laboratory Hot Plate With Copper Plate and Max Temperature 600 Celsius Degree and Nitrogen Purge

Laboratory Hot Plate With Copper Plate and Max Temperature 600 Celsius Degree and Nitrogen Purge
Laboratory Hot Plate With Copper Plate and Max Temperature 600 Celsius Degree and Nitrogen Purge
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Product Description

CHEMAT TECHNOLOGY, Inc. has designed and manufactured a compact and easy-to-use Laboratory Hot Plate With Copper Plate, Model KW-4AH, for baking and curing thin films and coatings.

Its rugged, portable design, and temperature uniformity make it a versatile tool for research facilities. In conjunction with KW-4A spin coater, KW-4AH Laboratory Hot Plate With Copper Plate can be used to fabricate metal oxide thin films, polymer coatings and metal organic thin films.

Operation: Manual Load
Process Control: Program (For details see OMRAN operation manual)
Temperature fluctuation: 1C
Temperature uniformity: 3%

Temperature Range:
_30C - 350C (KW-4AH-350)
_30C - 600C (KW-4AH-600)

Substrate Size:
_7.5 inch X 7.5 inch(KW-4AH-350)
_5.8 inch X 5.8 inch(KW-4AH-600)

Inert gas purge (KW-4AH-600 only)

   
Model NO.:  KW-4AH-600
Unit Price:  Negotiable
Shipment Terms:  FOB
Payment Terms:  T/T
Price Valid Time:  From Oct 14,2011 To Oct 14,2012
Packing:  Corrugated Box
Application:  Labs
Type:  Thermal Curing
Export Markets:  North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Company: Shanghai Chemat Advanced Ceramics Technology. Co., Ltd.

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