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Home » Product Directory » Chemicals » Adhesive » Hot Melt Grain for Notebook Bonding (TH-404)

Hot Melt Grain for Notebook Bonding (TH-404)

Hot Melt Grain for Notebook Bonding (TH-404)
Hot Melt Grain for Notebook Bonding (TH-404)

Product Description

It use in higher grade notebook spine bond.

Hangzhou Tianchuang Chemical Technology Co., Ltd. is a manufacytory which profession deals with hot melt micelle, hot melt glue stick, hot melt ad-hesive film, hot melt pressure sensitive adhesive and so on. The target of our product relate to various industries, including electron, packaging, book binding, pri-nting, filters, furniture, car inner, car light, sound box, PP, PET label, mat, computer embroider, zipper, dress ect. We export our product to Europe & America market.

More Product Features

   
Trademark:  TIANCHUANG
Model NO.:  TH-404
Standard:  White transparent grain
Productivity:  2000000KGS/MONTH
Shipment Terms:  By Sea
Payment Terms:  L/C,T/T
Minimum Order:  1000 kgs
Origin:  Hangzhou
Packing:  25kg/Bag
Company: Hangzhou Tianchuang Chemical Technology Co., Ltd.

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