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Diamond CMP Pad Conditioner
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Product Description
We manufature diamond CMP pad conditioner, which apply to silion wafer
Teh features: The single layer brazing technics make the chemical bond between diamond and brazing metal to ensure the hold diamond.
Diamond dicing blades: Silicon, semiconductor, such as GaAs, Gap, etc.
Diamond thin blades: Apply to wafers/crystals, semiconducor padckages, glass, quartz, sapphire, printed board, ceramics.
| Productivity: | 10.000 pcs/year |
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| Unit Price: | US $ 50.00/ Piece |
| Shipment Terms: | FOB |
| Company: | Xiamen Chiaping Diamond Industrial Co., Ltd. |
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