In our modern life, many electronic devices are widely used, such as computer, Office Automatic equipment, Audio devices, Video devices, Mobile devices, Communication devices, Automatic controlling systems, and so on. The core of these electric devices is kinds of semi-conductor components. We can say the semi-conductor industry is the heart and soul of electronic industry. In the process of producing these semi-conductor devices, very high precision required. The surface of semi-conductor wafers, including silicon wafer and compound semi-conductor wafers, must be precisely lapped. The most suitable material to process the surface of semi-conductor wafers.

RO is the lapping powder we produce special for above processing. We choose high quality raw material. Under our strict producing course control & quality control system, it is produced by our special technology. It has special shape and hardness. And it can provide constant and stable lapping ability with no scratch on the lapping surfaces.

RO is suitable for lapping many materials, not only the silicon wafer and compound semi-conductor wafer, but also Optical glassware, lens, prisms, quartz, etc.