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Home » Product Directory » Chemicals » Chemical Auxiliary & Catalyst » Surface Disposal Agent » Copper Electroplating Intermediate Additives (27206-35-5)

Copper Electroplating Intermediate Additives (27206-35-5)

Copper Electroplating Intermediate Additives (27206-35-5)
Copper Electroplating Intermediate Additives (27206-35-5)

Product Description

Chemical name: Bis-(sodium sulfopropyl)-disulfide
Molecular formula: C6H12O6S4Na2
Molecular weight: 354.4
CAS No.: 27206-35-5

Characteristic:
Appearance: White or yellowish powder
Assay(%)  : ≥ 90.0
Solubility: 38%(in water)
pH: 3-7 ( 38% water solution)
Concentration in the bath: 10-100mg/L
Application
As a brightener agent for acid copper baths for decorative and functional deposits, it is functionally compatible with most components of typical copper bath formulation such as non-ionic surfactants, polymeric amines and other mercapto compounds.

Pakage: 25kg
Storage condition: Stored in cool and dry place

More Product Features

   
Model NO.:  27206-35-5
Standard:  J&C
Productivity:  customers′ request
Packing:  25kg
Company: Jadechem Chemicals Co. Ltd

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