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Power Module PCB (8 Layers)
 Power Module PCB (8 Layers) |
Product Description
Material: FR-4
Layer Coverage: 8 Layers
Thickness: 1.6 mm
Surface Technique: Immersion Gold
Specialty: Copper Weight 175 um
Blind-via/Buried-via
Larger Current
| Productivity: | 15000pcs |
|---|---|
| Type: | Rigid |
| Number of Layers: | 8-Layers |
| Dielectric: | FR-4 |
| Company: | Shenzhen GeLaiDe Electronics Co., Ltd. |
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