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Offer Details
PCB
| Offer Type: | ![]() |
|---|---|
| Offer Group: | PCB |
| Offer Post Time: | 2009-12-07 |
| Expiration Date: | 2009-12-31 |
| Details: |
Category single-sided, double-sided, multi-layer
Laminate type FR-2, CEM-1, CEM-3, FR-4 Copper thickness 0.5OZ-5OZ Circuit formation dry film, photo imageable ink, silk-screen Solder mask photo imageable ink, oven-cured ink, UV ink, peelable, mask ink Legend marking oven-cured ink, Uvink Conductive paste carbon paste, silver paste Surface treatment Hot air leveling, electro-nickel, electro-nickel/gold, electroless nickel gold, Entek, preflux Outline formation CNC routing, die punching, V-CUT, beveling Circuit test computerized circuit test 10V-300V, insulation resistance 1 to 40M |
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