Category single-sided, double-sided, multi-layer

Laminate type FR-2, CEM-1, CEM-3, FR-4

Copper thickness 0.5OZ-5OZ

Circuit formation dry film, photo imageable ink, silk-screen

Solder mask photo imageable ink, oven-cured ink, UV ink, peelable, mask ink

Legend marking oven-cured ink, Uvink

Conductive paste carbon paste, silver paste

Surface treatment Hot air leveling, electro-nickel, electro-nickel/gold, electroless nickel gold, Entek, preflux

Outline formation CNC routing, die punching, V-CUT, beveling

Circuit test computerized circuit test 10V-300V, insulation resistance 1 to 40M¦¸