Hot Air Leveling
OSP(eg. Entek)
Flash Gold
Immersion Gold, Tin & Silver
Gold Finger Plating OSP
HIGH FREQUENCY PCB (E. G. TELFON, ROGERS MAT'L BOARD)

Peelable Mase
Carbon Ink
Blind & Buried Vias Board
Aluminium Substrate
Back Panel 5. 0mm

No. Of Layers Available   2- 24  
Min. Line Width   0. 10mm  
Min. Line Spacing  0. 10mm  
Min. Annual Ring PTH 0. 15mm    
Non-PTH 0. 20mm    
Min Hole Size PTH 0. 25mm  
Non-PTH 0. 30mm  
Hole Aspect Ratio   5  
Min. Board Thickness Single & Double Sided 0. 3mm    
Multilayer (4, 6, 8, 10) 0. 4mm, 1. 0mm, 1. 2mm, 1. 5mm  
Max Board Size   450mm X 800mm  
Solder Mask Pitch   0. 1mm  
Hole Tolerance PTH +/- 0. 076mm    
Non-PTH +/- 0. 05mm    
Hole Position Tolerance   +/- 0. 076mm  
Outline Tolerance Routing +/- 0. 15mm  
Punching +/- 0. 15mm    
Thickness Tolerance   MIL-P-13949 Class 2  
V-Cut Tolerance Depth +/- 0. 15mm  
Position +/- 0. 15mm  
Gold Finger   5u " - 50u "