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Offer Details
Mobile Phone PCB (RoHS)
| Offer Type: |  |
|---|---|
| Offer Group: | PCB-high idensity(ROHS) |
| Offer Post Time: | 2008-12-03 |
| Expiration Date: | 2009-06-12 |
| Details: | Layer: 8
Material: FR4 ROHS&UL standard Min line width: 0.1mm Min line space: 0.1mm The smallest hole: 0.1mm Buried and blind via structure: L1-L3, L5-L7 Surface processing; Immersion gold |
