Main offers covering Circuit Board, more info please click as follows.
Offer List
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.12mm
Buried and blind via structure
Surface processing; HAL
Green...
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Expiration Date: 2009-06-12]
Layer: 4
Material: FR4
Thickness: 1.4mm
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L2; L2-L...
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Expiration Date: 2009-06-12]
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.326mm
Min line space: 0.251mm
The smallest hole: 0.261mm
Surface processing; ENIG
Green soldermark
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Expiration Date: 2009-06-12]
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.2mm
Buried and blind via structure
Surface processing; Gold platin...
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Expiration Date: 2009-06-12]
Layer: 2
Material: EM-1
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Surface processing; Immersion gold
Yellow soldermark
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Expiration Date: 2009-06-12]
Layer: 10
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L7, L2-L5, L6-L8
Surface pro...
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Expiration Date: 2009-06-12]
Minimum space size: 0.2mm
ROHS&UL standard
NO. Of IC: 65PCS
Soldering compoent: 6089 pcs
Minum compoent size: 0603
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Expiration Date: 2009-06-12]
Layer: 2
Material: FR4
Thickness: 1.6mm
ROHS&UL standard
Min line width: 0.2mm
Min line space: 0.2mm
The smallest hole: 0.2mm
Surface processing; HAL
Green soldermark
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Expiration Date: 2009-06-12]
Minimum space size: 0.1mm
ROHS&UL standard
NO. Of IC: 40PCS
Soldering compoent: 5089 pcs
Minum compoent size: 0201
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Expiration Date: 2009-06-12]
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.306mm
Min line space: 0.216mm
The smallest hole: 0.221mm
Surface processing; Gold plating
Green soldermark
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Expiration Date: 2009-06-12]
Layer: 12
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L4, L3-L6, L7-L8
Surface pro...
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Expiration Date: 2009-06-12]
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.211mm
The smallest hole: 0.206mm
Surface processing; OSP
Green Soldermask
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Expiration Date: 2009-06-12]
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L4, L5-L6
Surface processing;...
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Expiration Date: 2009-06-12]
Board material type: High-Tg
Min line width: 0.10mm
Min line space: 0.10mm
Out layer copper thickness: 8.75um
Hole diameter tolerance4 (Mechanical drill): 0.05mm
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Expiration Date: 2009-06-12]
Layer: 8
Material: FR4
Thickness: 2.0mm
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L2; L2-L3, L...
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Expiration Date: 2009-06-12]
Single board
Gold plating of surface finish
Yellow soldermask
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Expiration Date: 2009-06-12]
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.11mm
Min line space: 0.12mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L6
Surface processing; Imme...
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Expiration Date: 2009-06-12]
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L2-L4, L1-L3
Surface processing;...
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Expiration Date: 2009-06-12]
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L2-L4, , L2-L3, L4-L6
Surfac...
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Expiration Date: 2009-06-12]
Layer: 4
Material: FR4
Thickness: 1.6mm
ROHS&UL standard
Min line width: 0.254mm
Min line space: 0.254mm
The smallest hole: 0.3mm
Surface processing; Immersion gold
Green s...
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Expiration Date: 2009-06-12]
Layer: 4
Material: FR4
Thickness: 1.8mm
ROHS&UL standard
Min line width: 0.18mm
Min line space: 0.18mm
The smallest hole: 0.235mm
Surface processing; Immersion gold
Green s...
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Expiration Date: 2009-06-12]
Layer: 2
Board material type: High-Tg
Min line width: 0.2mm
Min line space: 0.0238
Finished hole diameter (Mechanical drill): 0.2mm
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Expiration Date: 2009-06-12]
Layer: 2
Material: FR4
ROHS standard
Min line width: 0.16mm
Min line space: 0.16mm
The smallest hole: 0.2mm
Surface processing; Hot Air Level
Red soldermark
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Expiration Date: 2009-06-12]
Layer: 4
Material: FR4
Standard: ROHS&UL
Min line width: 0.218mm
Min line space: 0.211mm
The smallest hole: 0.206mm
Buried and blind via structure: L1-L2, L1-L4 L3-L4
Surfa...
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Expiration Date: 2009-06-12]
Minimum space size: 0.2mm
ROHS&UL standard
NO. Of IC: 85PCS
Soldering compoent: 6888pcs
Minum compoent size: 0201
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Expiration Date: 2009-06-12]
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.15mm
Min line space: 0.15mm
The smallest hole: 0.2mm
Buried and blind via structure
Surface processing; Gold Finger...
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Expiration Date: 2009-06-12]
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.3mm
Min line space: 0.236mm
The smallest hole: 0.212mm
Surface processing; Immersion silver
Green soldermark
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Expiration Date: 2009-06-12]
HDI PCB (ROHS & UL)
Description:
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.12mm
We can delievery t...
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Expiration Date: 2009-06-12]