Offer List (Total 43 Offers)
Military PCB (RoHS)
Layer: 4
Material: FR4
Thickness: 1.4mm
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L2; L2-L...
[
Expiration Date: 2009-06-12]
8 Layer PCB (RoHS & UL)
Layer: 8
Material: FR4
Thinkness: 1.6mm
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure
Surface process...
[Expiration Date: 2009-06-12]
PCB (RoHS)
HDI
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.16mm
Surface processing; Hot Air Level
Green soldermark
[Expiration Date: 2009-06-12]
12 Layer HDI PCB (ROHS & UL)
Layer: 12
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L4, L3-L6, L7-L8
Surface pro...
[Expiration Date: 2009-06-12]
PCB (ROHS)
Layer: 2
Material: FR4
Thickness: 1.6mm
ROHS&UL standard
Min line width: 0.2mm
Min line space: 0.2mm
The smallest hole: 0.2mm
Surface processing; HAL
Green soldermark
[Expiration Date: 2009-06-12]
PCB
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.306mm
Min line space: 0.216mm
The smallest hole: 0.221mm
Surface processing; Gold plating
Green soldermark
[Expiration Date: 2009-06-12]
6 Layer HDI PCB (ROHS & UL)
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L2-L4, , L2-L3, L4-L6
Surfac...
[Expiration Date: 2009-06-12]
10 Layer PCB (ROHS & UL)
Layer: 10
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L7, L2-L5, L6-L8
Surface pro...
[Expiration Date: 2009-06-12]
HDI PCBA (ROHS & UL)
Minimum space size: 0.1mm
ROHS&UL standard
NO. Of IC: 60PCS
Soldering compoent: 3079 pcs
Minum compoent size: 0603
[Expiration Date: 2009-06-12]
4 Layer Impedance Control PCB (ROHS)
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.3mm
Min line space: 0.21mm
The smallest hole: 0.216mm
Blind via structure: L1-L2
Surface processing; Hot Air Level
...
[Expiration Date: 2009-06-12]
Lead Free HASL PCB
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.326mm
Min line space: 0.251mm
The smallest hole: 0.261mm
Surface processing; ENIG
Green soldermark
[Expiration Date: 2009-06-12]
PCB-Blind and Buried Via (RoHS & UL)
Layer: 8
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.12mm
Buried and blind via structure: L2-L4, L5-L7
Surface processi...
[Expiration Date: 2009-06-12]
PCB (ROHS)
Layer: 2
Material: EM-1
ROHS&UL standard
Min line width: 0.1-0.3mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Surface processing; Immersion gold
Yellow soldermark
[Expiration Date: 2009-06-12]
PCB-Red Soldermask
Layer: 2
Material: FR4
ROHS standard
Min line width: 0.16mm
Min line space: 0.16mm
The smallest hole: 0.2mm
Surface processing; Hot Air Level
Red soldermark
[Expiration Date: 2009-06-12]
HDI PCB (ROHS&UL)
Layer: 4
Material: FR4
Thickness: 1.8mm
ROHS&UL standard
Min line width: 0.18mm
Min line space: 0.18mm
The smallest hole: 0.235mm
Surface processing; Immersion gold
Green s...
[Expiration Date: 2009-06-12]
20 Layer HDI PCB (RoHS & UL)
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.12mm
Min line space: 0.12mm
The smallest hole: 0.2mm
Buried and blind via structure
Surface processing; Gold platin...
[Expiration Date: 2009-06-12]
Simple PCB
Single board
Gold plating of surface finish
Yellow soldermask
[Expiration Date: 2009-06-12]
HDI PCB (RoHS & UL)
Layer: 2
Material: FR4
ROHS&UL standard
Min line width: 0.256mm
Min line space: 0.256mm
The smallest hole: 0.3mm
Surface processing; Immersion tin
Green soldermark
[Expiration Date: 2009-06-12]
PCB-Blue Soldermask
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.15mm
Min line space: 0.15mm
The smallest hole: 0.2mm
Buried and blind via structure
Surface processing; Gold Finger...
[Expiration Date: 2009-06-12]
Keyboard PCB
Layer: 4
Material: FR4
Standard: ROHS&UL
Min line width: 0.218mm
Min line space: 0.211mm
The smallest hole: 0.206mm
Buried and blind via structure: L1-L2, L1-L4 L3-L4
Surfa...
[Expiration Date: 2009-06-12]
PCBA (ROHS)
Minimum space size: 0.2mm
ROHS&UL standard
NO. Of IC: 85PCS
Soldering compoent: 6888pcs
Minum compoent size: 0201
[Expiration Date: 2009-06-12]
PCBA / BGA Soldering (RoHS & UL)
Minimum space size: 0.2mm
ROHS&UL standard
NO. Of IC: 65PCS
Soldering compoent: 6089 pcs
Minum compoent size: 0603
[Expiration Date: 2009-06-12]
PCB-Cell Phone (ROHS & UL)
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L4, L5-L6
Surface processing;...
[Expiration Date: 2009-06-12]
4 Layer Immersion Gold PCBA
Minimum space size: 0.1mm
ROHS&UL standard
NO. Of IC: 40PCS
Soldering compoent: 5089 pcs
Minum compoent size: 0201
[Expiration Date: 2009-06-12]
4 Layer Innersion Gold PCB (RoHS)
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.1mm
Min line space: 0.1mm
The smallest hole: 0.1mm
Buried and blind via structure: L2-L4, L1-L3
Surface processing;...
[Expiration Date: 2009-06-12]
HDI PCB
Layer: 6
Material: FR4
ROHS&UL standard
Min line width: 0.11mm
Min line space: 0.12mm
The smallest hole: 0.1mm
Buried and blind via structure: L1-L6
Surface processing; Imme...
[Expiration Date: 2009-06-12]
4 Layer Impedance Control PCB (ROHS)
Layer: 4
Material: FR4
ROHS&UL standard
Min line width: 0.11
Min line space: 0.11mm
The smallest hole: 0.126mm
Buried and blind via structure
Surface processing; Hot Air Lev...
[Expiration Date: 2009-06-12]
2 Layer PCB (ROHS & UL)
Layer: 2
Material: FR4
Thickness: 1.0mm
ROHS&UL standard
Min line width: 0.2mm
Min line space: 0.2mm
The smallest hole: 0.25mm
Surface processing; HAL
Green soldermark
[Expiration Date: 2009-06-12]
