PCB for Mobile Phone
![]() PCB for Mobile Phone |
Product Description
Type: Rigid PCB
Layer: 8-Layers
Material: FR4, 1.2mm
Surface: Immersion gold
Apply to: Mobile phone
PCB Special: Main board
Circuit Board for Mobile Phone Capabilities:
Layer count: 1~20Layers
Base material: FR4, CEM-1/3, aluminium-based
G. T. Temperature: Tg135, Tg150, Tg170
Board thickness: 0.2mm~3.2mm
Tolerance of thickness.: +/-10%
Base copper weight: Min.: 12um(1/3oz)
Max.: 70um for inner layer: 140um(4oz) for outer layer
Min. Finished hold size: By mechanical drilling: 0.2mm
By laser drilling: 0.05mm
Tolerance of hole: PTH: +/-0.075mm
NPTH: +/-0.05mm
Min. Trace width/space: Inner layer: 0.1mm/0.1mm
Outer layer: 0.1mm/0.1mm
Max. Panel size: Single/Double side: 650mmx450mm
Multilayer: 500mmx450mm
Surface treatment: HASL, Lead Free HASL, Immersion Gold/Tin/Silver, OSP or Entek, Flash/plating Gold, Gold Finger, Carbon Print, Peelable mask
Thick gold plating up to 2um(80u")
Solder mask color: Green, Blue, White, Black, etc
Solder mask type: LPI, Matte
Outline finish type: CNC Routing, V-Scoring, Punch
The tolerance of outline: Routed: +/-0.15mm;
Scored: +/-0.2mm
E-Test voltage: 10V~250V
E-Test continuity: 10~ 1000ohms
| Trademark: | PCB |
|---|---|
| Model NO.: | P023 |
| Company: | Stariver Electronics (H. K. ) Co., Ltd. |
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