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Home » Product Directory » Tools & Hardware » Abrasive & Grinding » Special Micropowder for Wire Cutting (2849200000)

Special Micropowder for Wire Cutting (2849200000)

Special Micropowder for Wire Cutting (2849200000)
Special Micropowder for Wire Cutting (2849200000)

Product Description

1. Special micro powder for solar wafer cutting
Kind: Green silicon carbide micro powder, black silicon carbide micro powder.
Size: F500 F600 JIS800 JIS1000 JIS1200 JIS1500

2. Special micro powder for semiconductor wafer cutting
Kind: Green silicon carbide micro powder, black silicon carbide micro powder.
Size: F500 F600 JIS800 JIS1000 JIS1200 JIS1500

3. Special micro powder for piezoelectric wafer cutting
Kind: Green silicon carbide micro powder, black silicon carbide micro powder.
Size: JIS500 JIS 600 JIS700 JIS800 JIS1000 JIS1200 JIS1500 JIS2000 JIS2500 JISJIS3000

More Product Features

   
Trademark:  XDX
Model NO.:  2849200000
Standard:  FEPA JIS ISO ANSI
Productivity:  25000T/Y
Company: Henan Xindaxin Science & Technology Co., Ltd.

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