Product Description »
Applications:
Used for the wire saw of 3-12 inch monocrystslline silicon, polycrytallinesilicon, potassium arsenide, quartz crystal. It is the abrasive material for solar industry, semiconductor industry, and piezoelectric industry.
Features:
1. High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physial condition;
2. Grains are rounder with lots of sharper corner, which means minimium TTV;
3. Paticle size distribution is narrow and even;
4. High heat resisting and softing temperature under duty guarantee the small wire expansion in processing, suitable to all kinds of wiresaw machining;
5. Grain surface processed specially, easily fit carrier liquid, such as glycol.
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