Total 20 Offer(s)
in
Semiconductor
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2009-05-07]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2, 500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature charact...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2009-07-01]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2009-06-03]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
Description:
Features:
1) Electrical isolation between chips and substrate, 2,500V AC
2) International standard encapsulation
3) Full press-fit construction, superior temperature characte...
[Expiration Date: 2008-12-26]
|
