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Multi Layers Flexible Printed Circuit Board
 Multi Layers Flexible Printed Circuit Board |
Product Description
Key Specifications/Special Features:
Maximum number of layer: 1 to 8 layers
Surface treatment: ENIG (immersion gold), gold plating
Minimum conductor width/space: 0.08mm/0.08mm
Minimum pitch: 0.15mm
Minimum hole size: 0.2mm
Maximum working panel: 240 x 250mm
Profiling: Punching
Based material: Available for RA and ED cooper(94V-0); 1/3 OZ-1OZ
With or without adhesive
Cover layer: PI and yellow/green solder mask
Stiffener: PI; FR4; Steel; Kapton
Double side adhesive: 3M
Peeling strength: 1.0kg/cm
Solder heat resistance: 260 degree/10 secs
Applied for mobile phone bending cable, RoHS compliant.
More Product Features
| Trademark: | CIRCUITEK |
|---|---|
| Standard: | IPC class 2 |
| Productivity: | 4, 000, 000 sq feet /month |
| Shipment Terms: | FOB HongKong |
| Origin: | Shenzhen China |
| Packing: | Vacuum Carton Package |
| Company: | Shen Nan Circuit Co., ltd |
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