10 Layers R-F PCB Flex-Rigid Board with Buried and Blind Via

Product Description

A multilayer rigid-flex circuit board having two or more conductive layers, with at least one rigid circuit board electrically connected to at least one flexible jumper connector or intercircuit connector circuit board, is disclosed. A conductive layer of each of the rigid circuit boards is connected electrically and mechanically to a conductive layer of the flexible jumper connector by an interconnecting adhesive layer. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, electrically conductive particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding the mechanical strain of the interconnection and the thermal cycling and typical circuit board fabrication, finishing and assembly processes. Such a rigid-flex circuit is typically used in an environment where space is limited. During installation, the flexible connector is generally bent to adapt to the dimensional constraint of the surroundings.

Material: CCL
Two Types of Copper: RA Copper for high frequency bending application, ED Copper for very low or one time bending application
CCL Thickness: 0.018mm (0.72mil) Half oz / 0.036mm (1.4mil) 1 oz / 0.071mm (2.8mil) 2oz - Only for massive current
Substrate (Kapton / Polyimide): 0.013mm (0.5mil) / 0.025mm (1mil) / 0.051mm(2mil)
Adhesive Thickness: 0.013mm(0.5mil) to 0.020mm (0.8mil)
For Rigid-Flex Material: FR-4, FR-5, Rogers, Halogen Free Material
Coverlay
Kapton / Polyimide Thickness: 0.013mm (0.5mil) / 0.025mm (1mil) / 0.051mm (2mil)
Adhesive Thickness: 0.013mm(0.5mil) to 0.036mm (1.4mil)
Coverlay rigistration tolerance: <0.1mm
Stiffener
PI / PET / FR4 (according to fabrication requirements)
Thickness Tolerance: ± 0.03mm
Dimension tolerance; ± 0.3mm

Surface Treatment Type
Immersion Tin - Standard 0.5um to 1um (20u" - 40u")
Immersion Gold: 2u"
Electrolysis Gold: 20u" - 40u"
Nickel Plating: Hard Ni- 3um (120u") / Soft Ni - 6um(240u")

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