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HDI PCB
 HDI PCB |
Product Description
High Density Interconnect (HDI) is a type of PCB employing fine circuit patterns and microvia interconnections to achieve high wiring density to miniaturise electrical modules; Typically used for products such as mobile phones, PDAs, digital cameras and notebook PCS.
Key Specifications/Special Features:
HDI PCBs
Number of layers: Up to 10 layers (Structure: 2+N+2)
Maximum panel size: 16 x 18'
Major material: FR-4
Minimum board thickness:
Four layers: 0.6mm (24 mil)
Six layers: 0.8mm (32 mil)
Eight layers: 1.0mm (40 mil)
10 layer: 1.2mm (48 mil)
Maximum board thickness: 2.4mm (95 mil)
Surface finishing:
Flash gold plating
Immersion gold (maximum 0.5 micrometer)
Thick gold plating (maximum 1.0 micrometer)
Hot-air solder leveling
Entek coating (OSP)
Solder mask: LPI (wet film), thermal cured type
Other print:
Carbon print, peelable solder mask
Solder mask plugged hole
Copper thickness (finishing): 1/2 ounce (18 micrometer) to 2 ounce (72 micrometer)
Minimum hole size:
Buried dia: 0.1mm (4 mil)
Blind dia: 0.2mm (4 mil)
Through hole: 0.2mm (4 mil)
Maximum aspect ratio: 8: 1
Minimum line width and spacing: 0.1mm (4 mil)
Profile and v-cut:
V-cut, jump v-cut, CNC v-cut
CNC-routing, stamping and beveling
Special process: Blind/buried via hole
Immersion gold surfacing finishing
FR4, TG range from 130 to 170
More Product Features
| HS Code: | 85399000 |
|---|---|
| Trademark: | SCC |
| Standard: | IPC class 2 IPC class 3 |
| Productivity: | 30, 000 square feet/month |
| Shipment Terms: | FCA HongKong |
| Origin: | Shenzhen China |
| Packing: | Vacuum Carton Package |
| Type: | Rigid |
| Number of Layers: | 10-Layers |
| Dielectric: | FR-4 |
| Company: | Shen Nan Circuit Co., ltd |
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