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Hybrid Thick Film Technology

Hybrid Thick Film Technology
Hybrid Thick Film Technology

Product Description

Since founded in 1965, CSIMC has engaged in developing, importing, improving, integrating and applying technologies and processes that include SSI, MSI, semiconductor device packaging, hybrid thick film IC, hybrid thin film IC, magnetic devices, power modules, SMT and PCB assembly, low temperature co-firing ceramic (LTCC) etc.

Hybrid thick film integrated technology can offer multi-layer and fine line circuits with minimal size and optimal layout which enhance high frequency characteristics. It can also be used for high power modules using stainless steel and Al2O3/AlN substrate. Furthermore, laser trimming enables producing resistor, inductor and capacitor networks with arbitrary value. The wire bonding and the substrate characteristics result in the circuits with high anti-flushing and anti-vibration quality, strong adhesion, reducing connection and high reliability.

   
Company: Chongqing Sichuan Instrument Microcircuit Co., Ltd.

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