Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate pictures & photos

Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate

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Price

Min. Order Reference FOB Price

2 Pieces US$10.00-20.00 / Piece

Sepcifications

Application Refractory, Industrial Ceramic
Type Ceramic Plates
Transport Package Packaged by Polybay and Bubble Bag in The Stardard
Specification OEM
Trademark BB
Origin China
Color Ivory
Density 3.3 g/cm3
Size Customized
Thermal Conductivity(30°c, W/M.K) >170
Flexural Strength (MPa) 382.7
Keyword Copper Coated
Dielectric Strength (Kv/mm) 18.45
MOQ 2 PCS
Keywords 1 Aluminum Nitride Substrate
Keywords 2 Copper Plating Substrate
Material Aluminum Nitride

Product Description

Product Description Electronic Direct Bond Copper Low Dielectric Constant Aln Plate High Thermal Conductivity Customized DBC Aluminum Nitride Ceramic Substrate ...

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LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.

Gold Member Since 2015

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Quartz Glass, Alumina Ceramics, Zirconia Ceramics, Cordierite Ceramics, Porous Ceramics, Silicon Carbide Ceramics, Steatite Ceramics, Silicon Nitride Ceramics, Aluminium Nitride Ceramics, Ozone Generator
Number of Employees 53
Year of Establishment 2016-04-29
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Metallized Ceramic Comparison

	Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate Contact Now	Quick View High Mechanical Strength Square Aluminum Nitride Ceramic Substrate Contact Now	Quick View High-Frequency Capability Customized Aluminum Nitride Substrate Board Contact Now	Quick View Circuit Board Aluminum Nitride Substrate for Semiconductor Contact Now	Quick View Not Metallized Aluminum Nitride Substrate For Electronics Contact Now

Transaction Info
	Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate Contact Now	Quick View High Mechanical Strength Square Aluminum Nitride Ceramic Substrate Contact Now	Quick View High-Frequency Capability Customized Aluminum Nitride Substrate Board Contact Now	Quick View Circuit Board Aluminum Nitride Substrate for Semiconductor Contact Now	Quick View Not Metallized Aluminum Nitride Substrate For Electronics Contact Now
Price	US $ 10.00-20.00/ Piece	US $ 3.68-26.47/ Piece	US $ 3.68-26.47/ Piece	US $ 3.68-26.47/ Piece	US $ 3.68-26.47/ Piece
Min Order	2 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Money Gram, Credit Card	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal
Quality Control
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia
Annual Export Revenue	-	-	-	-	-
Business Model	-	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Application: Refractory, Industrial Ceramic; Type: Ceramic Plates; Color: Ivory; Density: 3.3 g/cm3; Size: Customized; Thermal Conductivity(30°c, W/M.K): >170; Flexural Strength (MPa): 382.7; Keyword: Copper Coated; Dielectric Strength (Kv/mm): 18.45; MOQ: 2 PCS; Keywords 1: Aluminum Nitride Substrate; Keywords 2: Copper Plating Substrate; Material: Aluminum Nitride;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;	Application: Electronics, Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;
Supplier Name	LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.
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