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31682 pcb pcba fpc for sale.You can wholesale pcb pcba fpc products with high quality and low prices from about 856 pcb pcba fpc wholesalers .
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Complex
Application:
Communication
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Metal Coating:
Copper
Mode of Production:
SMT
Layers:
Multilayer
Base Material:
FR-4
Certification:
RoHS, CCC, ISO
Customized:
Customized
Structure:
Multilayer FPC
Material:
Polyimide
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Base Material:
Copper
Insulation Materials:
Organic Resin
Type:
Flexible Circuit Board
Flame Retardant Properties:
V0
Dielectric:
Pi
Base Material:
Copper
Insulation Materials:
Organic Resin
Processing Technology:
Electrolytic Foil
Type:
Rigid Circuit Board
Dielectric:
FR-6
Material:
Fiberglass Epoxy
Application:
Medical Instruments
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Fiberglass Epoxy Resin + Polyimide Resin
Application:
Consumer Electronics
Flame Retardant Properties:
V2
Mechanical Rigid:
Rigid
Type:
Combining Rigid Circuit Board
Dielectric:
FR-4
Material:
Fr4
Application:
Consumer Electronics
Flame Retardant Properties:
V2
Mechanical Rigid:
Rigid
Structure:
Single-Sided FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Structure:
Single-Sided FPC
Material:
Copper
Combination Mode:
Without Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Aviation and Aerospace
Flame Retardant Properties:
V0
Processing Technology:
Des
Insulation Materials:
Organic Resin
Flame Retardant Properties:
V0
Application:
Aerospace
Base Material:
Pi+Fr4
Service:
7*24 Hours Online
Technology:
Lead The Industry
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
US$ 1-10 / Square Meter
1 Square Meter (MOQ)
Contact Now
Structure:
Multilayer FPC
Material:
Nelco Arlon Isola
Combination Mode:
Adhesive Flexible Plate
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Structure:
Single-Sided FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Insulation Materials:
Organic Resin
Flame Retardant Properties:
V0
Application:
Digital Products
Structure:
Single-Sided Rigid Flex PCB
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Flame Retardant Properties:
V0
Base Material:
Copper
Structure:
Multilayer FPC
Material:
Polyester Film
Combination Mode:
Without Adhesive Flexible Plate
Application:
Computer with LCD Screen, Mobile Phone
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Structure:
Single-Sided FPC
Material:
Polyimide
Combination Mode:
Without Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace,Consumer Electronics
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Type:
Combining Rigid Circuit Board
Dielectric:
CEM-3
Material:
Fiberglass Epoxy
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Processing Technology:
Electrolytic Foil
Structure:
Double-Sided FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Task:
Adjust
Structure:
Open-Loop
Mathematical Model:
Linear
Signal:
Continuous
Function:
Automatic Control
Certification:
RoHS, ISO: 9001, CE
Structure:
Double-Sided FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Metal Coating:
Gold
Mode of Production:
SMT
Layers:
Multilayer
Base Material:
FR-4
Certification:
RoHS, CCC, ISO
Customized:
Customized
Structure:
Multilayer FPC
Material:
Polyimide
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Fiberglass Epoxy
Application:
Medical Instruments
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
Type:
Combining Rigid Circuit Board
Dielectric:
CEM-3
Material:
Complex
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Processing Technology:
Electrolytic Foil
Insulation Materials:
Epoxy Resin
Flame Retardant Properties:
V0
Application:
Consumer Electronics
Layer:
1-8 Layers
Common Finish Board Thickness:
0.3-5mm
Raw Material:
Aluminum Base, Copper Base
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Structure:
Single-Sided FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Fiberglass Epoxy
Application:
Medical Instruments
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Structure:
Single-Sided FPC
Material:
Polyimide
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive:
Conductive Silver Paste
Flame Retardant Properties:
V0
Type:
94V-0 Multilayer PCB
Dielectric:
FR-4
Material:
Customized
Application:
All
Flame Retardant Properties:
Customized
Mechanical Rigid:
Rigid, Fexible, Rigid and Fexible
Insulation Materials:
Epoxy Resin
Flame Retardant Properties:
V0
Application:
Consumer Electronics
Surface Finishing:
Enig 2u''
PCB Material:
Fr4+Pi
Surface:
Enig 2u
Metal Coating:
Copper
Mode of Production:
DIP
Layers:
Multilayer
Base Material:
FR-5
Certification:
RoHS, CCC, ISO
Customized:
Customized
Type:
Rigid Flexible Circuit Board
Flame Retardant Properties:
V0
Dielectric:
Fr4 + Polymide
Base Material:
Fr4 + Polymide
Insulation Materials:
Epoxy Resin
Processing Technology:
Electrolytic Foil
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Fiberglass Epoxy
Application:
Medical Instruments
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Metal Coating:
Gold
Mode of Production:
SMT and Tht PCB Assembly
Layers:
Single/Double Layer/Multilayer
Base Material:
FR-4
Certification:
RoHS, CCC, ISO, TUV:Sud
Customized:
Customized
Structure:
Multilayer Rigid PCB
Dielectric:
FR-4
Material:
Polyester Glass Fiber Mat Laminate
Application:
Communication
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Structure:
Multilayer Rigid PCB
Dielectric:
FR-4
Material:
Phenolic Paper Laminate
Application:
Medical Instruments
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Fiberglass Epoxy
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Processing Technology:
Electrolytic Foil
Type:
Rigid Circuit Board
Flame Retardant Properties:
V0
Dielectric:
FR-4
Base Material:
Aluminum
Insulation Materials:
Organic Resin
Processing Technology:
Electrolytic Foil
Type:
Combining Rigid Circuit Board
Dielectric:
FR-4
Material:
Complex
Application:
Aerospace
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Structure:
Multilayer FPC
Material:
Polyester Film
Combination Mode:
Without Adhesive Flexible Plate
Application:
Computer with LCD Screen, Mobile Phone
Conductive Adhesive:
Anisotropic Conductive Adhesive
Flame Retardant Properties:
V0
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