Production Description: CS-9810B is organic RTV2 silicone rubber potting compounds. Component A is black thick liquid, Component B is white thick liquid. Both A and B component can be stored respectively for a long time before mixed. The silicone mainly used in High power electronic components potting, lighting fixture potting. Such as flashlight, Wall lights, Spot lights, switching power supply, transformer power supply, LED module automobile HID power, auto ignition system module power, network transformer, etc, . Strictly comply with the RoHS requirements Features: *This silicone rubber has good thermal conductivity, heat dissipation, insulation, elasticity, corrosion resistance, weather resisting, flame resistance etc. It is available in a wide temperature range (-60 ~ 250 centigrade) after cured. *Excellent waterproof and moistureproof and anti-aging performance. No shrinkage in solidification process. Use and Precautions: *The colloid contained thermal conductive materials, long-time storage will caused stratification and precipitation. So before using, we should stir A and B component respectively, in that way, then could according to the quality ratio 1: 1 stir into the mixing tank. *When filling the mixed colloid into potting device, we could not take vacuum deaeration, but if need to obtain high thermal conductivity, it is recommended that the vacuum deaeration. Both room temperature curing and heating curing are acceptable. The curing speed have a lot to do with the curing temperature. At a lower temperature will extend the curing time, we suggest heating to speed up the curing time. 80 centigrade need 15-30 minutes curing, at room temperature usually need 5 hours. *Unused glue should be sealed storage. The storage period is 10 months(25 centigrade). The mixed glue should be used up at once, to avoid any waste. *This product is a non-dangerous goods, do not expose to eyes and mouth. *Adhesive react with below chemical substance will caused curing agent failure (trace amounts of below substance will not affect curing): . N, P, S organic compounds . Sn, Pb, Hg, As ionic compounds elements . Alkynes and more vinyl compounds . In order to avoid the above phenomenon, when using on circuit board, we should clean up the residues resin, use low lead solder as far as possible. Statement: Before using this products, users should read the production information carefully. Users have the responsibility to take a comprehensive testing according to their own purpose so as to confirm its safety, performance, effect, etc. Our company has no other statement or implied guarantee. If the quality problems are caused by users for their direct use without taking any relevant performance testing. Our company and sales person will bear no responsibility.