| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14 or Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
|
Type: Rigid Circuit Board;
Dielectric: Ceramic-Filled PTFE Composite Laminate;
Material: Ceramic-Filled PTFE Composite Laminate;
Application: Traffic Jam Pilot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: PTFE/Ceramic Composite Provides:;
Insulation Materials: PTFE/Ceramic Composite Provides:;
Brand: Rogers;
Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion;
Layer Count: Single Sided, Double Sided, Multi-Layer PCB, Hybri;
Solder Mask: Green, Black, Blue, Yellow, Red, Purple etc.;
Dissipation Factor: 0.0011;
PCB Material: Ceramic-Filled PTFE Laminates;
|
Type: Rigid Circuit Board;
Dielectric: Taconic Tsm-Ds3;
Material: Ceramic-Filled Woven Fiberglass PTFE Laminates;
Application: High-Performance RF Applications.;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Taconic Tsm-Ds3 with a Core Thickness of 0.762 mm;
Insulation Materials: Ceramic-Filled Fiberglass.;
Brand: Taconic;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally.;
Board Types: Rigid PCB;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4/Tg/Cem-1/Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14 or Custom;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
|