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What is Shenzhen OEM Electronic Manufacturing Vendor Multilayer SMT PCB Assembly

Min. Order / Reference FOB Price

1 0 US $1-20 / 0

Company Profile

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Product Description

Shenzhen OEM Electronic Manufacturing Vendor Multilayer SMT PCB Assembly Who we are? Shenzhen Grandtop Electronics Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global ...

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PCB Board Comparison

Shenzhen OEM Electronic Manufacturing Vendor Multilayer SMT PCB Assembly

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Transaction Info
Price US $ 1.0-20.0/ Piece US $ 180.0-185.0/ Set US $ 180.0-186.0/ Piece US $ 180.0-185.0/ Piece US $ 180.0-185.0/ Set
Min Order 1 Pieces 1 Sets 1 Pieces 10 Pieces 1 Sets
Trade Terms - - - - -
Payment Terms L/C, T/T, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM - - - -
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1 Month(s)
- - - -
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Raspberry Pi 3 Model B Pi;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Raspberry Pi 3 Model B Pi;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Raspberry Pi 3 Model B Pi;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Raspberry Pi 3 Model B Pi;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Sunhokey Electronics Co., Ltd.

China Supplier - Gold Member Audited Supplier

Sunhokey Electronics Co., Ltd.

China Supplier - Gold Member Audited Supplier

Sunhokey Electronics Co., Ltd.

China Supplier - Gold Member Audited Supplier

Sunhokey Electronics Co., Ltd.

China Supplier - Gold Member Audited Supplier

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