Specification |
Application: Telecom Products,Electronics;
Feature: Moisture Proof, Recyclable, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
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Application: Promotion, Household, Chemical, Industrial;
Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
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Application: Promotion, Household, Chemical, Industrial Use;
Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
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Application: Food, Chemical, IC;
Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic;
Material: PE+Pet;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Polypropylene Plastic Bag;
Bag Variety: Back Seal Bags;
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Application: Promotion, Household, Chemical, Industrial Use;
Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Printing: Blank or Customized;
4 Layers: Pet/Al/Ny/PE;
Thickness: 0.085-0.14 mm;
Puncture Resistance: >100n;
Peel Strength: >3.0n/ 15mm;
Vapor Transmission: 0.002mg/100 In2 /24h;
Applications: Electronics,PCB,Optical Lens, IC, LED,LCD;
Pattern: Flat,Cubic,Gusset,Ziplock;
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