Half-Vias Complex PCB
US$3.00 - 3.90 / Piece
4 Layers Half-Vias Complex Printed Circuit Board PCB pictures & photos
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4 Layers Half-Vias Complex Printed Circuit Board PCB pictures & photos
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4 Layers Half-Vias Complex Printed Circuit Board PCB pictures & photos
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4 Layers Half-Vias Complex Printed Circuit Board PCB pictures & photos
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4 Layers Half-Vias Complex Printed Circuit Board PCB pictures & photos
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4 Layers Half-Vias Complex Printed Circuit Board PCB pictures & photos
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What is 4 Layers Half-Vias Complex Printed Circuit Board PCB

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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-49 Pieces US$3.90

50-499 Pieces US$3.60

500+ Pieces US$3.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Computer
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Uc
  • Transport Package Vacuum Package
  • Specification UL, ISO, RoHs, TS, SGS
  • Trademark UC
  • Origin Shenzhen, China
  • Soldermask Color Green
  • Board Thickness 2.0mm
  • Panel Size 200)160mm

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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Half-Vias Complex PCB Comparison

4 Layers Half-Vias Complex Printed Circuit Board PCB

4 Layers Half-Vias Complex Printed Circuit Board PCB

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Transaction Info
Price US$3.00 - 3.90 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 - 1.10 / Piece
Min Order 1 Piece 100 Pieces 100 Pieces 100 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/Cqciatf/UL/RoHS/etc
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Soldermask Color: Green;
Board Thickness: 2.0mm;
Panel Size: 200)160mm;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Unice;
Layer: 1-20;
OEM/ODM: Support;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Testing: 100%;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

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