Specification |
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pet, PC;
Insulation Materials: Organic Resin;
Brand: Mc;
Color: Pantone Color Number;
Push Button Type: Embossed Poly Dome, Metal Dome, Flat, Non Tactile;
Adhesive: 3m Self Adhesive;
Basic Material: Pet, PC, PMMA, PVC, Silicone, Rubber, Metal, etc.;
Reliability Service Life: > 1 Million Times;
Working Temperature: - 20 °c - + 70 °c;
Storage Temperature: - 40 °c - + 85 °c, 95% ± - 5%;
Atmospheric Pressure: 86 - 106kpa;
Insulation Resistance: ≥ 100m Ω (100V / DC);
Logo: Custom Silk Screen Printing, Digital Printing;
Function: Waterproof, Dustproof, UV Resistant;
Dimension/Shape: OEM Service;
Used for: High Temperature, Long Term UV Exposure;
Pin Picth: 2.54, 1.27, 1.0mm;
Surface: Glossy / Matte Finish;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Board Thickness: 0.13mm / 0.18mm / Custom;
Custom: OEM;
Copper: 1oz / 36um;
Layers: 1 Layer, 2 Layers;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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