Diamond Wire for Silicon Wafering

The use of diamond wire for cutting silicon wafes is much more efficient than traditional cutting method. The following benfits can be achieved when using diamond wire cutting technology and related products.

1. 2 times faster than slurry;
2. Faster return on investment;
3. Increased capacity without increasing capital expenditures;
4. Lower cost/wafer resulting from reduced TCO;
5. Less expensive secondary process costs;
6. Reduced running costs such as electricity and cooling water;

7. No slurry mixing or supply and recovery systems required;
8. Improved TTV;
9. Reduced bow and warp;
10. Holistic approach to cutting;
11. Enhanced RA surface finish reduces secondary processes;
12. Excellent cutting accuracy;
13. No PEG and SiC hazardous waste management;
14. Cleaner and faster process.