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Composite Filament, ABS+PLA Filament for 3D Printer
Min. Order: | 1 Piece |
---|---|
Payment Terms: | T/T |
Product Description
Company Info
Product Description
1. ABS + PLA
2. ABS + PLA + Carbon Fiber
3. More coming: Ceramic, Glass, Resin...
New for customization.
Colors: White, Black, Transparent, Red, Green, Blue, Yellow, Orange,
Purple, Pink, Golden, Fluorescein Red/Green/Yellow, Customized.
Wire Diameter: 1.75mm, 1.80mm, 3.00mm.
Packing Roll type: White paperboard, craft paper (OEM color).
Roll size: 200mm; Bore diameter: 53mm; Width: 56mm, 62mm, 80mm.
Weight: 0.7kg, 0.8kg, 1kg.
Package: Paper roll, PE film, Desiccant, Aluminum Foil Sealing bag, Carton.
Certificate: SGS RoHS.
2. ABS + PLA + Carbon Fiber
3. More coming: Ceramic, Glass, Resin...
New for customization.
Colors: White, Black, Transparent, Red, Green, Blue, Yellow, Orange,
Purple, Pink, Golden, Fluorescein Red/Green/Yellow, Customized.
Wire Diameter: 1.75mm, 1.80mm, 3.00mm.
Packing Roll type: White paperboard, craft paper (OEM color).
Roll size: 200mm; Bore diameter: 53mm; Width: 56mm, 62mm, 80mm.
Weight: 0.7kg, 0.8kg, 1kg.
Package: Paper roll, PE film, Desiccant, Aluminum Foil Sealing bag, Carton.
Certificate: SGS RoHS.
Address:
Bldg. 1st, Zhongkang Industrial Park, Futian District, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Tools & Hardware
Management System Certification:
ISO 9001
Company Introduction:
E-FOND ELECTRONICS TECH Co., Limited is located in city of innovative design - Shenzhen. It is a global pioneer in designing customized mobile devices like Tablet PC and other handheld devices since found in 2004. It is a high tech enterprise who integrates R&D, manufacture, sales and after service.
Taking advantage of years R&D, supply chain management and manufacture strength, we have made a breakthrough on Self-developed products and customized service system. As early as 2010, we have launched our new generation mobile interconnect product - Tablet PC and Smartphone on platform MTK, Rockchip, Allwinner, etc. Based on OEM business mode and strict Quality control system (IQC, PQC, OQC), we have exported Tablet PC and Smartphone to many countries in Europe, Asia, America and Oceania.
As the 3D Printing technology and industry′s development, E-FOND is convinced it will change many aspects of manufacturing industry and people′s life. Therefore, in recent years, E-FOND has devoted in 3D Printing area, and has employed many members having more than 10-year experience in 3D Printing industry. At present, E-FOND has established long-term developing strategy in 3D Printing Industry and has got advantages in 3D Printing materials.
Taking advantage of years R&D, supply chain management and manufacture strength, we have made a breakthrough on Self-developed products and customized service system. As early as 2010, we have launched our new generation mobile interconnect product - Tablet PC and Smartphone on platform MTK, Rockchip, Allwinner, etc. Based on OEM business mode and strict Quality control system (IQC, PQC, OQC), we have exported Tablet PC and Smartphone to many countries in Europe, Asia, America and Oceania.
As the 3D Printing technology and industry′s development, E-FOND is convinced it will change many aspects of manufacturing industry and people′s life. Therefore, in recent years, E-FOND has devoted in 3D Printing area, and has employed many members having more than 10-year experience in 3D Printing industry. At present, E-FOND has established long-term developing strategy in 3D Printing Industry and has got advantages in 3D Printing materials.