Basic Info.
Type
Flexible Circuit Board
Flame Retardant Properties
V2
Insulation Materials
Organic Resin
Processing Technology
Electrolytic Foil
Application
Consumer Electronics
Material
Fiberglass Epoxy
Substrate
Aluminium Oxide, Aluminium Nitride
Reflection
Normal: 85-92%, High:≥93%
Surface Finiching
Ni/Au, Chem.AG, OSP etc.
Panel Size
101.6*101.6mm, 114.3*114.3mm, 120*120mm, 130*140mm
Board Thickness
Min.0.38mm, Max. 2.0mm
Peel Strength
No Broken Trace at E Poine, Gold Wire≥7g
Dielectric Constant
9-10@1MHz
Lead Time
3-5 Days for Prototype, 7-10 Days for Production
Inspection Standard
Mil-Sid-105, Class2, Aol=0.65
Specification
101.6*101.6mm, 114.3*114.3mm, 120*120mm, 130*140mm
Product Description
| Item | Rigid PCB | Flexible PCB | Rigi-Flex PCB |
| Max Layer | 60L | 8L | 36L |
| Inner Layer Min Trace/Space | 3/3mil | 3/3mil | 3/3mil |
| Out layer Min Trace/Space | 3/3mil | 3.5/4mil | 3.5/4mil |
| Inner Layer Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 6oz | 2oz | 3oz |
| Min Mechanical Drilling | 0.15mm | 0.1mm | 0.15mm |
| Min Laser Driliing | 0.1mm | 0.1mm | 0.1mm |
| Max Aspect Ratio(Mechanical Drilling) | 20:01 | 10:01 | 12:01 |
| Max Aspect Ratio(Laser Drilling) | 1:01 | / | 1:01 |
| Press Fit Hole Ttolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH Tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
| NPTH Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| Countersink Tolerace | ±0.15mm | ±0.15mm | ±0.15mm |
| Board Thickness | 0.4-8mm | 0.1-0.5mm | ±0.15mm |
| Board Thickness Tolerance(<1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Board Thickness Tolerance(≥1.0mm) | ±10% | / | ±10% |
| Min Board Size | 10*10mm | 5*10mm | 10*10mm |
| Max Board Size | 22.5*30 inch | 9*14 inch | 22.5*30 inch |
| Contour Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
| Min BGA | 7 mil | 7 mil | 7 mil |
| Min SMT | 7*10mil | 7*10mil | 7*10mil |
| Min solder Mask Clearance | 1.5mil | 3mil | 1.5mil |
| Min Solder mask Dam | 3mil | 8mil | 3mil |
| Min Legand Width/Height | 4/23mil | 4/23mil | 4/23mil |
| Strain Fillet Width | / | 1.5±0.5mm | 1.5±0.5mm |
| Bow&Twist | 0.003 | / | 0.0005 |
Why choose us?
Our company has advanced processing equipments for ceramic circuit boards. It has the ability to integrate with international technology in the process of laser drilling, cutting, metallization of ceramics, electroplating and thickening of ceramics, through-hole electroplating and filling holes, fabrication of micro-circuits, etc.
Our Advantages:
1.High thermal conductivity
2. Excellent insulation performance
3. Extremely low coefficient of expansion
4. Lower dielectric constant and loss
5. Chemical Corrosion Resistance | 1 | Items | Ceramic Substrate |
| 2 | Substrate | Aluminium oxide, Aluminium nitride |
| 3 | Conductor thk | 10-210um |
| 4 | Thermal conductivity | Al203,20-24W/M.k;ALN, 170-220 W/M.k |
| 5 | Reflection | normal: 85-92%, high:≥93% |
| 6 | Surface finiching | Ni/Au, chem.AG, OSP etc. |
| 7 | Panel size | 101.6*101.6mm, 114.3*114.3mm, 120*120mm, 130*140mm, 140*190mm |
| 8 | Board thickness | Min.0.38mm, Max. 2.0mm |
| 9 | Min hole size | 0.08mm |
| 10 | Outline tolerance | ±0.1mm |
| 11 | Peel strength | No broken trace at E poine, gold wire≥7g |
| 12 | Dielectric constant | 9-10@1MHz |
| 13 | Dielectric Strength | ≥2KV |
| 14 | Lead time | 3-5 days for prototype, 7-10 days for production |
| 15 | Inspection standard | MIL-SID-105, class2, AOL=0.65 |
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| Layer | Quick Turn/Usual Time | Mass Production |
| 2L | 24 hours/4-5 days | 8-10 days |
| 4L | 48 hours/6-7 days | 10-12 days |
| 6L | 72 hours/7-8 days | 12-14 days |
| 8L | 72 hours/8-10 days | 16-18 days |
| 10L | 96 hours/12-14 days | 18-20 days |
Address:
Yingxianstreet, Tianjin, China
Business Type:
Manufacturer/Factory
Business Range:
Auto, Motorcycle Parts & Accessories, Computer Products, Construction & Decoration, Consumer Electronics, Electrical & Electronics, Manufacturing & Processing Machinery, Textile
Company Introduction:
TIANJIN NEW BLUE OCEAN e-business Co., Ltd, The main product is PCB and PCBA panel. We begin business in China many years. Welcome your inquiry.
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