Fast-Diamond-Coated Wire for Silicon Bricking or Silicon Squaring

Electroplated Diamond Wire is a composited product by a special technology, to electroplate a layer of diamond abrasive particles on high strength steel wire. It is considered as a most prospective high technology product to achieve high efficiency precise cutting for hard and brittle materials such as silicon, sapphire, SiC, Ge, GaAs, glass, ceramics, crystal, YAG, magnetic materials, W alloy.

Compared with steel wire and band saw cutting, the electroplated diamond wire cutting have many advantages: 1) Faster cutting than steel wire; 2) Economical production: No slurry, only city water or water-based coolant; Diamond wire cut repeatedly; 3) High production capacity; 4) Minimum kerfloss; 5) Lower roughness; 6) Better wafer quality.