Pedal Dust Bin Stainless Steel, 5L
| FOB Price: | US$3.30 / Piece |
|---|---|
| Min. Order: | 1,000 Pieces |
| Min. Order | FOB Price |
|---|---|
| 1,000 Pieces | US$3.30 |
| Port: | Shenzhen, China |
|---|---|
| Production Capacity: | 1000000/Year |
| Payment Terms: | T/T |
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Product Description
Company Info
Address:
Room 204, No. 18, 1st Street, Lede Road, Lecong Town, Shunde, Foshan, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Bags, Cases & Boxes, Light Industry & Daily Use, Lights & Lighting, Tools & Hardware
Company Introduction:
Hong Kong Xiang Shun Technology Co., Ltd was established in 2017 in Hong Kong, supplying tungsten copper series, molybdenum copper series, CMC, S-CMC, HS-CMC series, CPC series, aluminum silicon carbide, silicon aluminum, dispersed copper series, tungsten, molybdenum, kovar, invar, oxygen-free copper, etc., and undertaking other
External processing business. We have office in Foshan city and Zhuji city, our factory is located in Zhuji, the famous hometown of Yue dynasty and Xi Shi, and was formally established in October 2019. The company is a high-tech enterprise integrating material research and development and production. The company is mainly engaged in the research and development and production of microelectronic chip heat sinks and new packaging materials. The products are related to 5G communication, new energy vehicles, smart phones, aerospace, unmanned aerial vehicles, electronic power of high-speed trains, LED, laser, infrared, microwave, radio frequency devices and other technical application fields. Domestic products are leading, and several series have achieved import substitution.
We look forward to cooperate with you
External processing business. We have office in Foshan city and Zhuji city, our factory is located in Zhuji, the famous hometown of Yue dynasty and Xi Shi, and was formally established in October 2019. The company is a high-tech enterprise integrating material research and development and production. The company is mainly engaged in the research and development and production of microelectronic chip heat sinks and new packaging materials. The products are related to 5G communication, new energy vehicles, smart phones, aerospace, unmanned aerial vehicles, electronic power of high-speed trains, LED, laser, infrared, microwave, radio frequency devices and other technical application fields. Domestic products are leading, and several series have achieved import substitution.
We look forward to cooperate with you
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