Tungsten-Copper Heat Sinks

Tungsten-Copper heat sinks
It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.
1. The space with high-performance materials
Tungsten copper materials with high density, high sweat cooling performance, high temperature strength and resistance to scour the ablation performance, such as in the aerospace industry as a missile, rocket nozzle throat liner, jet vane components, air rudder, hood and weight, etc.My company has 45 years of research and application of tungsten permeability history of copper products, has won the second prize of national invention, and obtains the national secret patent.
2, vacuum contactor material
My company production of tungsten and copper/copper composite contactor does not contain the third alloying elements, the tungsten substrate through above 2000 ºC high temperature sintering, whole through a high vacuum processing, has the material evenly, gas and low content of impurities, high conductivity and good composite interface, copper layer density, etc.Over the years, the vast majority of domestic vacuum load switch tube manufacturers are using compound contact my company.Hundreds of thousands of pieces of the production capacity can meet the needs of all the new and old friends.
Advantages: high ablation resistance, high toughness, good conductivity, thermal conductivity.Machining performance is good.
Delivery status: brace connection good, such as copper, steel shapes of W - Cu contact.
Semi-finished products: raw melt infiltration, casting materials;Unprocessed various contact, welding or brazing on copper or steel support;Welding or brazing process.
Our company also produce all kinds of welding or brazing contact fittings.
3, electronic packaging materials and heat sink materials
W - Cu electronic encapsulation materials, has low expansion properties of tungsten, but also has high thermal conductivity characteristics of copper, is particularly valuable is that its thermal expansion coefficient and thermal conductivity can by adjusting the composition and material design, and thus to the application of this material has brought great convenience.We adopt high purity high quality raw material, after pressing, high temperature sintering and melt permeability, got the good performance of W - Cu electronic packaging materials and heat sink materials.Apply to with high power device packaging materials, such as substrate and electrode;High performance of lead frame;Thermal control devices of military and civilian thermal control panel and radiator, etc.
Advantages: with different matrix matching of thermal expansion coefficient and high thermal conductivity;Excellent high temperature stability and uniformity;Excellent processing performance;
Product specifications: the surface plating Ni, NiAu or electroless plating Ni W - Cu plate, the maximum size of 200 x300 mm, the thickness of 0.1-100 - mm.
Semi-finished products: raw melt infiltration, casting materials;Unprocessed various contact, welding or brazing on copper or steel support;Welding or brazing process.
Our company also produce all kinds of welding or brazing contact fittings.

Tungsten copper performance contrast