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Home » Product Directory » Industrial Equipment & Components » Welding & Solder » ZM-R5860C Hot Air+ IR BGA Rework Station

ZM-R5860C Hot Air+ IR BGA Rework Station

ZM-R5860C Hot Air+ IR BGA Rework Station
ZM-R5860C Hot Air+ IR BGA Rework Station

Product Description

1. Adopt liner slide which makes X\Y\Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability.
2. High definition touch screen (Taiwan), PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function.
3. There are 3 independent heating areas from top to bottom. The 1st and 2ND are hot-air heaters, the 3rd is IR preheating, temperature controlled within ± 3 ° . Top heater can be adjusted freely, second heater can be adjusted up and down, and the top and the bottom temperature can control many groups and sections of temperature parameters at the same time. The power consumption of the third IR heater can be adjusted.
4. Offer all kinds of hot-air nozzle, it can rotate 360° C. With magnet, easy to install and change, customized is available. Bottom IR heater ensure an even heat for PCB board.
5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.

6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.
7. Powerful cross-flow fan rapidly cool the PCB board to improve efficiency. Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.
8. After finish desoldering & soldering, there is an alarming and alarming in advance.
9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens, with a double over-heating protection control.
10. CCD vision system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision.

Specifications and technical parameters

1 Total Power 4700W
2 Top heater 800W
3 Bottom heater 2ND heater 1200W, 3rd IR heater 2700W
4 Power supply AC220V± 10% 50/60Hz
5 dimension 635× 600× 560mm
6 Positioning V-groove, PCB support can be adjusted in any direction with external universal fixture
7 Temperature control (K Sensor) closed loop, independent heating, precision within ± 3° C.
8 PCB size Max 410× 370mm Min 20× 20 mm
9 Electrical selection Highly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC
10 Weight total weight with wooden box is 108KG

More Product Features

   
Standard:  CE Certification
Productivity:  1000sets/Year
Origin:  Zm
Packing:  Wooden Box
Welding Method:  Hot Air
Type:  Wave Soldering
Export Markets:  North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Company: Jinliyang Technology Co., Ltd.

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