PCB Design
US$0.10-10.00 / Piece
View
  • Recommend for you
  • What is Multilayer PCB Services with Factory Price
  • What is Customzied Printed Circuit Board Multilayer PCB for Electronics Communication
  • What is Multilayer Electroless Nickel Immersion Gold PCB with Black Soldermask

What is High-Quality Motherboard Design Manufacturer Printed Circuit Board PCB Solutions

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand EEG
  • Transport Package Vacuum
  • Specification ENIG
  • Trademark EEG
  • Origin Made in China

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

Learn More

PCB Design Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.32-8.50/ Piece US $ 0.35-8.80/ Piece US $ 0.395-9.20/ Piece US $ 0.325-9.80/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Western Europe North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: EEG;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4-56layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier