PCB Production Line

US$5,130.00 / Piece

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Small Budget SMT Assembly Production Line with Printer and Oven pictures & photos

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What is Small Budget SMT Assembly Production Line with Printer and Oven

Name: Small Budget SMT Assembly Production Line with Printer and Oven
Uploaded: 2023-11-07T13:31:38+08:00
Description: PCB Prototype Line: 260*360mm solder paste printer+ NeoDen3V-S pick and place machine+ IN6 reflow oven Solder Paste Printer FP2636, G.W.: 13KG; good choice for prototype, small-batch of pcba produ

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$5,130.00 / Piece

Sepcifications

After-sales Service 1 Year
Condition New
Speed Medium Speed
Precision Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Semiautomatic
Type Medium-speed Chip Mounter
Transport Package Wooden Case
Trademark NeoDen
Origin Hangzhou
Name SMT Assembly Production Line
Application SMT PCB Prototype Labs or Manufacturing
Part 1 Neoden3V-S Pick and Place Machine
Part 2 440X320mm Solder Paste Printer
Part 3 T962A Reflow Oven
Placement Area 320X410mm Max.
Reflow Oven 300 Celcius

Product Description

PCB Prototype Line: 260*360mm solder paste printer+ NeoDen3V-S pick and place machine+ IN6 reflow oven Solder Paste Printer FP2636, G.W.: 13KG; good choice for prototype, small-batch of pcba production. (This type just available for single-side pcb solder pasting, if you need printer for ...

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Zhejiang NeoDen Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory
Main Products SMT Machine, Pick and Place Machine, SMT Assembly Line, SMT Production Line, Soldering Station, SMT Solder Paste Printer, SMT Assembly, Reflow Oven, X Ray Machine, Aoi Machine
Registered Capital 500000 RMB
Plant Area 1001~2000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Production Line Comparison

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Transaction Info
	Quick View Small Budget SMT Assembly Production Line with Printer and Oven Contact Now	Quick View Automatic Molding Machine for High Power Lasers Epoxy Dispensing Equipment Contact Now	Quick View High Power Lasers Die Attach Epoxy Machine Contact Now	Quick View China Die Attach Machine for Chip Packaging Contact Now	Quick View Automatic and Highly Precise Multi-Chip Packaging Die Attach Machine Contact Now
Price	US $ 5130/ Piece	US $ 100,000.00-300,000.00/ Piece	US $ 100,000.00-300,000.00/ Piece	US $ 250,000.00-450,000.00/ Piece	US $ 100,000.00-300,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T	T/T	T/T	T/T
Quality Control
Product Certification	ISO, CE	-	ISO, CE	-	ISO, CE
Management System Certification	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	After-sales Service: 1 Year; Condition: New; Speed: Medium Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Name: SMT Assembly Production Line; Application: SMT PCB Prototype Labs or Manufacturing; Part 1: Neoden3V-S Pick and Place Machine; Part 2: 440X320mm Solder Paste Printer; Part 3: T962A Reflow Oven; Placement Area: 320X410mm Max.; Reflow Oven: 300 Celcius;	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 500 N (Max); Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable); Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe; Uph: up to 10,000 Pieces Per Hour (Max);	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: Plusmn; 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: ± 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);
Supplier Name	Zhejiang NeoDen Technology Co., Ltd.	Suzhou Bozhon Semiconductor Co., Ltd	Suzhou Bozhon Semiconductor Co., Ltd	Suzhou Bozhon Semiconductor Co., Ltd	Suzhou Bozhon Semiconductor Co., Ltd
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