Low Light Image Sensor

892 results for Low Light Image Sensor

IP67 · Thermal Imaging System · Heat Detectors

Wholesale Vehicle Mounted Thermal Imaging for Collision Avoidance

US$ 519 / Set
1 Set  (MOQ)
Product Parameters Wholesale Vehicle Mounted Thermal Imaging for Collision Avoidance Thermal Imaging Camera Detector Resolution 256x192 Equivalent Resolution 384x512 AI-Super Resolution 1024x768 Pixel Size 12um Response Wave Band 8~14μm NETD ≤50mK@25ºC,F#1.0 Frame Rate 25H

Thermal Imaging System · ISO · Digital Type

Night Vision 640X512 Type-C CVBS Uncooled Mini Thermal Imaging Camera Module

US$ 650 / Piece
1 Piece  (MOQ)
Product Parameters Night Vision 640x512 Type-C CVBS Uncooled Mini Thermal Imaging Camera Module Model Mini640 Resolution 640×512 Detector Type Vox Detector Frame 50Hz Pixel Spacing 12μm Response Wave Band 8~14μm NETD ≤50mK@25ºC,F#1.0(≤40mK optional) Lens Focus

Thermal Imaging System · Microbolometer · SemiConductor Integrated

LWIR 640X512@12μm Uncooled Thermal Core Module for Clear Infrared Thermal Imaging

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

640x512@12μm Uncooled Vox Lwir Thermal Imaging Camera, infrared temperature camera for Smart Home

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Enhanced Stability and High Definition Uncooled 640x512/12um Infrared Camera Core

1 Piece  (MOQ)
Product Description COIN612R thermal camera for drone is developed by Global Sensor Technology (GST). It is small in size and light in weight, which can be easily integrated into light UAVs to realize all-weather monitoring of the air and ground conditions. The COIN612R infrared camera core in

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Cheap Compact Thermal Camera, Infrared Thermal Imaging Camera with 640x512@12μm Uncooled Lwir Infrared Detector

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

TIMO Series 256X192@12μm VOx Uncooled Infrared Sensors Detection Module

1 Piece  (MOQ)
Product Description TIMO256 is one of the TIMO series miniature infrared modules developed by Global Sensor Technology (GST). It integrates optical lens, 256x192@12μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and hea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Lwir 400x300@17μm IR Camera Module, Thermal Imaging Camera Module

1 Piece  (MOQ)
Product Description COIN417 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 400x300@17μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN417 infrared module

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Hot Sale Uncooled Infrared Camera Core with Uncooled 640x512 12um Infrared Detector

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Uncooled Mini Light Weight 640x512 Thermal Camera for Drones

1 Piece  (MOQ)
Product Description COIN612R is an affordable infrared camera with thermal imaging system designed for commercial unmanned air vehicles (drones/UAV). It is small in size and light in weight, which can be easily integrated into light UAVs to realize all-weather monitoring of the air and ground con
  • QWhat types of Low Light Image Sensors are commonly used for electronic devices?

    Low Light Image Sensors commonly come in CCD and CMOS varieties, offering different advantages in terms of image quality, power efficiency, and cost. Consult with a reputable producer for guidance on selecting the right sensor type for your application.

  • QHow can I ensure the quality and reliability of Low Light Image Sensor suppliers in China?

    When sourcing Low Light Image Sensors from China, validate supplier credentials, request product certifications and samples, and conduct on-site inspections if possible. Partnering with established manufacturers ensures adherence to industry standards and reliable product performance.

  • QWhat benefits do manufacturers gain from purchasing Low Light Image Sensors wholesale?

    Buying Low Light Image Sensors wholesale provides cost savings, availability for large-scale production, and streamlined inventory management. Benefit from volume discounts and customized solutions by partnering with reputable suppliers forming strong long-term manufacturing relationships.

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Thermal Camera Core for Industrial Inspection & Security Surveillance

1 Piece  (MOQ)
Product Description COIN612 infrared thermal camera module adopts the market prefered VOx technology and carries an uncooled IR FPA microbolometer high-resolution thermal sensor. It integrates 640x512 / 12μm wafer level package (WLP) infrared thermal detector, high performance signal proc

Thermal Imaging System · Microbolometer · SemiConductor Integrated

LWIR 256X192@12μm Uncooled Sensor Module with Thermography Available

1 Piece  (MOQ)
Product Description COIN212 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 256x192@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. It has an optional thermographic

Thermal Imaging System · Microbolometer · SemiConductor Integrated

LWIR Clear Thermal Imaging Module 12μm Pixel Size With typical NETD<40mk

1 Piece  (MOQ)
Product Description COIN612 infrared thermal camera module adopts the market prefered VOx technology and carries an uncooled IR FPA microbolometer high-resolution thermal sensor. It integrates 640x512 / 12μm wafer level package (WLP) infrared thermal detector, high performance signal proc

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Uncooled LWIR 640×512/12µm Infrared Camera Core Integrated into Secutrity Camera

1 Piece  (MOQ)
Product Description TWIN612 thermal module is a new arrival product developed by Global Sensor Technology. It integrates 640×512/12µm ceramic package uncooled infrared detector. With typical NETD<40mk, the TWIN612 thermal module could present clearer, sharper and more detailed image.

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Micro LWIR Uncooled Thermal Imaging Camera Modules 640x512 12um

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

The Ultimate Tool for Firefighting & Rescue: High-Performance Infrared Module

1 Piece  (MOQ)
Product Description TWIN612 thermal module is a new arrival product developed by Global Sensor Technology. It integrates 640×512/12µm ceramic package uncooled infrared detector. With typical NETD<40mk, the TWIN612 thermal module could present clearer, sharper and more detailed image.

Thermal Imaging System · Microbolometer · SemiConductor Integrated

COIN612R 640x512 / 12μm Drone Thermal Camera with Aerial Thermography and Clear Imaging

1 Piece  (MOQ)
Product Description COIN612R is an affordable infrared camera with thermal imaging system designed for commercial unmanned air vehicles (drones/UAV). It is small in size and light in weight, which can be easily integrated into light UAVs to realize all-weather monitoring of the air and ground con

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Precision in Power Maintenance: High-Performance Thermal Camera Module

1 Piece  (MOQ)
Product Description TWIN612 thermal module is a new arrival product developed by Global Sensor Technology. It integrates 640×512/12µm ceramic package uncooled infrared detector. With typical NETD<40mk, the TWIN612 thermal module could present clearer, sharper and more detailed image.

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Clearer Imaging with Uncooled Infrared Camera Core - 640x512/12µm

1 Piece  (MOQ)
Product Description COIN612 infrared thermal camera module adopts the market prefered VOx technology and carries an uncooled IR FPA microbolometer high-resolution thermal sensor. It integrates 640x512 / 12μm wafer level package (WLP) infrared thermal detector, high performance signal proc

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Fully Optimized SWaP TIMO Series Thermal Camera Module with 120X90@17μm uncooled Infrared Detector

1 Piece  (MOQ)
Product Description TIMO120 is one of the TIMO series miniature infrared modules developed by Global Sensor Technology (GST). It integrates optical lens, 120x90@17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and h

Thermal Imaging System · Microbolometer · SemiConductor Integrated

400x300@17μm Infrared Thermal Imaging Uncooled Camera Module for ADAS Application

1 Piece  (MOQ)
Product Description COIN417 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 400x300@17μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN417 infrared module

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Low Cost Infrared Thermal Camera with 640x512@12μm Vox Microbolometer FPA Detetcor

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

TIMO Series 256X192@12μm VOx Uncooled Thermal Core Module

1 Piece  (MOQ)
Product Description TIMO256 is one of the TIMO series miniature infrared modules developed by Global Sensor Technology (GST). It integrates optical lens, 256x192@12μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and hea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Advanced Thermal Vision with 640x512/12µm Uncooled Infrared Camera Module

1 Piece  (MOQ)
Product Description COIN612 infrared thermal camera module adopts the market prefered VOx technology and carries an uncooled IR FPA microbolometer high-resolution thermal sensor. It integrates 640x512 / 12μm wafer level package (WLP) infrared thermal detector, high performance signal proc

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Infrared Camera Core with Uncooled VOx 12um 640*512 Microbolometer

1 Piece  (MOQ)
Product Description COIN612 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 640x512@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN612 infrared module fea

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Miniature COIN212 thermal camera module with LWIR Uncooled Infrared Detector 256x192@12μm

1 Piece  (MOQ)
Product Description COIN212 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 256x192@12μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. It has an optional thermographic

Thermal Imaging System · Microbolometer · SemiConductor Integrated

LWIR 400x300@17μm COIN Series Uncooled Mini Infrared Thermal Imaging Surveillance Camera for Thermography

1 Piece  (MOQ)
Product Description COIN417 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 400x300@17μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN417 infrared module

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Highly Accurate Uncooled Infrared Camera Core 640x512/12µm

1 Piece  (MOQ)
Product Description COIN612 infrared thermal camera module adopts the market prefered VOx technology and carries an uncooled IR FPA microbolometer high-resolution thermal sensor. It integrates 640x512 / 12μm wafer level package (WLP) infrared thermal detector, high performance signal proc

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Fully Optimized SWaP TIMO Series Thermal Module with 120X90@17μm Infrared Thermal Detector

1 Piece  (MOQ)
Product Description TIMO120 is one of the TIMO series miniature infrared modules developed by Global Sensor Technology (GST). It integrates optical lens, 120x90@17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and h

Thermal Imaging System · Microbolometer · SemiConductor Integrated

Small Size 400x300@17μm Uncooled Thermal Imaging Module for AIoT Application

1 Piece  (MOQ)
Product Description COIN417 is one of the COIN series infrared modules developed by Global Sensor Technology (GST). It integrates 400x300@17μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. The COIN417 infrared module
Haven't found what you want?

Easy Sourcing

Post sourcing requests and get quotations quickly.

Product Alert

Subscribe to product alert and stay updated to what's new and popular on the market.