High Quality Diamond Grinding Wheel for LED Substrate for Back Thinning of Sapphire Epitaxial Wafer


US$3,058.00
10-99 Pieces
US$2,000.00
100+ Pieces

Manufacturing Process
Brazing
Shape
Round
Bonding Agent
Metal
Width
209mm,254mm,313mm,Customized
Thickness
Customized
Product Name
LED Substrate Metal Back Grinding Wheel

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