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Wholesale Wafer dicing machine

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High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

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High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

US$ 200000-500000 / Set

1 Set (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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Function: High Temperature Resistance

Demoulding: Automatic

Condition: New

Certification: ISO

Warranty: 12 Months

Automatic Grade: Automatic

Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

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Wafer Dicing Saw Machine Abrasive Wire Cutting Machine

US$ 10000-15000 / Piece

1 Piece (MOQ)

Uslugi Tech Co., Ltd.

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After-sales Service: After-Sales Service

Warranty: One Year

Application: Glass

Process Usage: Metal-Cutting CNC Machine Tools

Movement Method: Linear Control

Control Method: Closed-Loop Control

Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

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Acf Bonding Machine PCB Making Equipment Screen Repair Wafer Dicing DIP Component Placement

US$ 25000-50000 / Piece

1 Piece (MOQ)

Shenzhen Eastson Electronic Technology Co., Ltd.

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After-sales Service: One Year Warranty

Condition: New

Speed: High Speed

Precision: High Precision

Certification: ISO

Warranty: 12 Months

Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

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Fruit & Vegetable Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

US$ 2000-3500 / Piece

1 Piece (MOQ)

Zheng Zhou Taizy Trading Co., LTD

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After-sales Service: Online Support

Warranty: 1 Year

Type: Cutter

Voltage: 380V

Power: 0.75KW

Customized: Customized

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

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Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

US$ 5000-20000 / Set

1 Set (MOQ)

Wuhan TianXingTong Photoelectricity Technology Co., Ltd.

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5(4.3)

"Fast Delivery"

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After-sales Service: Installation & Operation Guide

Warranty: 24months

Laser Visibility: Invisible

Applicable Material: All

Cooling System: Water Cooling

Technical Class: Pulse Laser

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

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Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing

US$ 200000-500000 / Set

1 Set (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: 1 Year

Function: High Temperature Resistance

Demoulding: Automatic

Condition: New

Certification: ISO

Warranty: 12 Months

Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

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Fully-Enclosed 20W Water Cooling PCB Laser Cutting Machine for PCB Circuit Board and Silicon Wafer Dicing

US$ 5699.9-9999.9 / Piece

1 Piece (MOQ)

Chengdu Hf Future Technology Co., Ltd.

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5(5.0)

"Nice Customer Service"

Nice Customer Service

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After-sales Service: on Line Technical Support

Warranty: 1 Year

Application: Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry, Advertising Industry

Cooling System: Water Cooling

Technical Class: Continuous Wave Laser

Applicable Material: PCB

Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

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Abrasive Wire Cutting Machine Wafer Dicing Saw Machine

US$ 10000-15000 / Piece

1 Piece (MOQ)

Uslugi Tech Co., Ltd.

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After-sales Service: After-Sales Service

Warranty: One Year

Application: Glass

Process Usage: Metal-Cutting CNC Machine Tools

Movement Method: Linear Control

Control Method: Closed-Loop Control

Wafer Cutter Blade Dicing Equipment Cutting Machine

Wafer Cutter Blade Dicing Equipment Cutting Machine

Wafer Cutter Blade Dicing Equipment Cutting Machine

Wafer Cutter Blade Dicing Equipment Cutting Machine

Wafer Cutter Blade Dicing Equipment Cutting Machine

Wafer Cutter Blade Dicing Equipment Cutting Machine

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valid since 2019-03-27

(contact issuer for current status)

Wafer Cutter Blade Dicing Equipment Cutting Machine

US$ 5888 / Piece

1 Piece (MOQ)

Zhaoqing City WanShunDa Foodstuff Machinery Manufacture Co., Ltd.

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After-sales Service: Engineers Available to Service Machinery Overseas

Warranty: 1 Year

Certification: CE

Power Source: Electric

Process: Thermal Processing

Automatic Grade: Automatic

Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

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Potato Dicing Machine/Fruit Dicing Machine Wafer Dicing

US$ 2000-3500 / Piece

1 Piece (MOQ)

Zheng Zhou Taizy Trading Co., LTD

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After-sales Service: Online Support

Warranty: 1 Year

Type: Cutter

Voltage: 380V

Power: 0.75KW

Customized: Customized

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

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Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt

US$ 200000-300000 / Piece

1 Piece (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: Support

Warranty: 1 Year

Application: Semiconductor

Cooling System: Air Cooling

Technical Class: Pulse Laser

Applicable Material: Nonmetal

High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

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High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing

US$ 200000-500000 / Set

1 Set (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: 1 Year

Function: High Temperature Resistance

Demoulding: Automatic

Condition: New

Certification: ISO

Warranty: 12 Months

High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

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High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor

1 Piece (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: Provided

Function: High Temperature Resistance

Demoulding: Automatic

Condition: New

Certification: RoHS, ISO, CE

Warranty: 12 Months

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

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High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing

US$ 200000-500000 / Set

1 Set (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: 7*24 Hours

Warranty: 12 Months

Application: IC

Cooling System: Air Cooling

Technical Class: Continuous Wave Laser

Applicable Material: Metal

High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

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High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine

US$ 10000-15000 / Piece

1 Piece (MOQ)

Uslugi Tech Co., Ltd.

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After-sales Service: After-Sales Service

Warranty: One Year

Application: Glass

Process Usage: Metal-Cutting CNC Machine Tools

Movement Method: Linear Control

Control Method: Closed-Loop Control

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

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Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite

US$ 10000-15000 / Piece

1 Piece (MOQ)

Uslugi Tech Co., Ltd.

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After-sales Service: After-Sales Service

Warranty: One Year

Application: Glass

Process Usage: Metal-Cutting CNC Machine Tools

Movement Method: Linear Control

Control Method: Closed-Loop Control

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

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Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing

US$ 200000-300000 / Piece

1 Piece (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: Support

Warranty: 1 Year

Application: Semiconductor

Cooling System: Air Cooling

Technical Class: Pulse Laser

Applicable Material: Nonmetal

Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

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Fully Automatic Dicing Machine with IR Laser for Φ 300mm Wafers

1 Piece (MOQ)

Jiangsu Himalaya Semiconductor Co., Ltd.

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After-sales Service: Provided

Warranty: 12 Month

Application: Environmental Equipment, Aerospace Industry, Automotive Industry

Cooling System: Air Cooling

Technical Class: Pulse Laser

Applicable Material: Nonmetal

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Wafer Dicing Machine Solar Cell Laser Scribing Machine Cut Solar Cell

US$ 10000-12000 / Piece

1 Piece (MOQ)

QINHUANGDAO ZENITH SOLAR TECHNOLOGICAL CO., LTD.

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Condition: New

Automation: Automatic

After-sales Service: Engineers Available to Service Machinery Overseas

Application: Industrial

Integrated Design: All Part Inside & Samll Size

Laser: Fiber Laser

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

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Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials

US$ 10000-15000 / Piece

1 Piece (MOQ)

Uslugi Tech Co., Ltd.

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After-sales Service: After-Sales Service

Warranty: One Year

Application: Glass

Process Usage: Metal-Cutting CNC Machine Tools

Movement Method: Linear Control

Control Method: Closed-Loop Control

Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

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Wafer Fab Semiconductor Device Fabrication Mdhyds12fa 12 Inch Discing Saw Fully Automatic Precision Dicing Machine High Precision Dicing Machine

US$ 46000-183500 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 1200mm*1600mm*1800mm

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

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Fab Wafer Fab The Precision Dicing Machine Is Equipped with 2.4kw High-Power and High-Rigidity Gate Structure; Driven by Theta-Axis Dd Motor

US$ 47000-63000 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 1400mm×1350mm×1900mmDS9200 precision d

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

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Wafer Fabrication Beol Feol Ds9200 Precision Dicing Machine Is Equipped with 2.4kw High-Power DC Spindle, Suitable for Cutting Large Package Substrate Materials

US$ 47000-63000 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 1400mm×1350mm×1900mmDS9200 precision d

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

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Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

US$ 47000-63000 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 665mm*850mm*1650mm

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

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Beol Feol Fab Wafer Fab 12-Inch Automatic Precision Dicing Machine Reduces Labor Costs and Improves Production Efficiency

US$ 47000-63000 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 1200mm*1550mm*1800mm

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

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Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

US$ 47000-63000 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 1200mm*1550mm*1800mm

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

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3W UV Laser Marking Machine Engraving Machine for Metal Plastic Glass PCB

US$ 3880-4680 / Set

1 Set (MOQ)

Shandong CCI Co., Ltd.

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5(5.0)

"On-time Delivery"

On-time Delivery

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After-sales Service: Online Service or Site Service

Warranty: 12 Months After Bl Time

Laser Visibility: Visible

Applicable Material: Nonmetal

Cooling System: Water Cooling

Technical Class: Pulse Laser

Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

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Wafer Fab Beol Feol Mdhyds6l 6inch Dicing Saw for Semiconductor Industry Precision Scribing Machine Is Equipped with Imported High-Power DC Spindle

US$ 46000-183500 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

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After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 580mm*910mm*1650mm

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

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UV Laser Marking Machine Plastic PVC PE PP ABS Laser Printing Machine Price Laser Marker

US$ 3880-4680 / Set

1 Set (MOQ)

Shandong CCI Co., Ltd.

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5(5.0)

"Fast Delivery"

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After-sales Service: Online Service or Site Service

Warranty: 12 Months After Bl Time

Laser Visibility: Visible

Applicable Material: Nonmetal

Cooling System: Water Cooling

Technical Class: Pulse Laser

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

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Favorites

Wafer Fab Fab Beol Feol Mdhyds12b 12 Inch Discing Saw High Precision Dicing Machine Suitable for Cutting Large Package Substrate Materials

US$ 46000-183500 / Piece

1 Piece (MOQ)

Guangzhou Minder-Hightech co.,Ltd

View larger video & image

Contact Now

Add to inquiry basket to compare.

After-sales Service: 1 Year

Warranty: 1 Year

Packing: Wooden Crate

Standard: 1170mm*1030mm*1850mm

Port: Guangzhou, China

Production Capacity: 200PCS/Yearpcs/Year

Questions & Answers on Wholesale Wafer dicing machine

What types of Fruit & Vegetable Processing Machinery can I source from China?

Our Wholesale Wafer dicing machine offers exceptional quality within the Fruit & Vegetable Processing Machinery category.In China, you can find a variety of Fruit & Vegetable Processing Machinery, such as washing equipment, cutting machines, juicing systems, and drying facilities. These machines are designed to streamline the processing of fruits and vegetables for maximum efficiency.

What are the advantages of purchasing Fruit & Vegetable Processing Machinery directly from a manufacturer?

The Wholesale Wafer dicing machine is a premium choice in the Fruit & Vegetable Processing Machinery category.By sourcing directly from a manufacturer, you can benefit from competitive pricing, customization options, timely technical support, and after-sales services. Working closely with a reputable manufacturer ensures you receive high-quality machinery tailored to your specific processing requirements.

How do I choose a reliable manufacturer for Fruit & Vegetable Processing Machinery in China?

Upgrade your Fruit & Vegetable Processing Machinery with the elegant and durable Wholesale Wafer dicing machine.When selecting a manufacturer in China, conduct thorough research on their reputation, production capacity, and quality control measures. It is essential to visit their facilities, check certifications, and request product samples to assess the machinery's performance.

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