Molybdenum Target Binding Processing
| US$1,000.00 - 2,000.00 | 1 Piece (MOQ) |
Port:
Tianjin, China
Production Capacity:
500 Pieces
Payment Terms:
T/T
Luoyang Kewei Molybdenum&Tungsten Co., Ltd.
Henan, China
Last Login Date:
Aug 01, 2025
Main Products:
Molybdenum Electrode, Coated Molybdenum Electrode, Molybdenum Plate, Molybdenum Sheet, High Temperature Furnace Products, Flat Target, Tube Target
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Product Description
Company Info
Product Description
Target material bonding processing is a technique used to combine target materials with backing plates or other components.It is widely applied in magnetron sputtering,semiconductor manufacturing,flat-panel display,and other fields.Below are the main methods and technical features of target material bonding processing:
1.Main Methods of Target Material Bonding
• Adhesive Bonding
Conductive and thermally conductive epoxy resins are used to bond the target material to the backing plate.This method is cost-effective but has higher thermal resistance,which limits the power density and deposition rate of sputtered target materials.
• Soldering
Indium is commonly used as a solder due to its high thermal conductivity,low melting point,and low elastic modulus.These properties help reduce residual stress after bonding.When combined with ultrasonic technology,indium can better penetrate the target material and backing plate,enhancing bonding strength.
• Ultrasonic Bonding
Utilizing the high-frequency vibrations of ultrasonic waves,this method forms strong metallic bonds between the target material and backing plate at the microscopic level.It is characterized by high precision,high strength,and no pollution.
• Doped Solder Bonding
For example,in the bonding of ITO(Indium Tin Oxide)target materials,zinc is added to the indium solder to improve its fluidity and degassing performance.This reduces the gaps between the target material and backing plate,increasing the bonding rate and heat transfer efficiency.
2.Applications of Target Material Bonding Technology
• Semiconductor Chip Manufacturing
Ultrasonic bonding technology is used for high-precision target material bonding to meet the requirements of chip miniaturization and high performance.
• Flat-Panel Display Industry
It is used in the bonding of target materials for liquid crystal displays and OLED displays,ensuring uniform thin-film deposition over large areas.
• Solar Photovoltaic Field
It provides uniform and stable thin-film materials,reducing the series resistance of solar cells and improving photoelectric conversion efficiency.
3.Advantages of Target Material Bonding Technology
• High Precision and Strength
Ultrasonic bonding technology can precisely control welding energy and time,making it suitable for complex shapes and small-sized target materials.
• Reduced Thermal Resistance
Using low-melting-point metals such as indium as solder,combined with ultrasonic technology,can significantly reduce the thermal resistance between the target material and backing plate.
• Extended Service Life
By optimizing bonding processes(e.g.,using doped solder),the occurrence of target material cracking during use can be reduced,thereby extending the service life of the target material.
4.Future Development Trends
With the emergence of new materials(such as two-dimensional materials and superconducting materials),target material bonding technology is expected to further expand its application fields and provide support for the industrialization of new materials.
Target material bonding processing technology holds significant value in material science and electronic manufacturing.It will continue to evolve towards higher precision,lower thermal resistance,and adaptability to new materials in the future.
Address:
Science and Technology 2nd Road, Luoyang Advanced Manufacturing Agglomeration Zone, Luoyang, Henan, China
Business Type:
Manufacturer/Factory
Business Range:
Manufacturing & Processing Machinery, Metallurgy, Mineral & Energy
Management System Certification:
ISO 9001, ISO 14001
Company Introduction:
Luoyang Kewei Tungsten Molybdenum Co., Ltd
1, Basic information of the enterprise
Founded in 1996 with a registered capital of 105 million yuan, Kewei Tungsten Molybdenum is located in the advanced manufacturing cluster area of Jianxi. It is a deep processing enterprise of molybdenum, tungsten and its alloy new materials that integrates design, research and development, production, sales and services.
2, Product Introduction
1. Molybdenum electrodes, coated molybdenum electrodes, molybdenum plates, molybdenum sheets, and various shaped products are mainly used in various glass containers, glass fiber and ceramic fiber kilns, as well as various specialized high-temperature furnaces, single crystal growth furnaces, sapphire growth furnaces, etc;
2. Molybdenum flat target, molybdenum round target, molybdenum tube target, tungsten and tungsten alloy tube target, new display (LCD) and glass power generation, thin film power generation coating materials, the only domestic full process production enterprise;
3. Various high-temperature molybdenum and molybdenum alloy products, as well as tungsten and tungsten alloy products.
1, Basic information of the enterprise
Founded in 1996 with a registered capital of 105 million yuan, Kewei Tungsten Molybdenum is located in the advanced manufacturing cluster area of Jianxi. It is a deep processing enterprise of molybdenum, tungsten and its alloy new materials that integrates design, research and development, production, sales and services.
2, Product Introduction
1. Molybdenum electrodes, coated molybdenum electrodes, molybdenum plates, molybdenum sheets, and various shaped products are mainly used in various glass containers, glass fiber and ceramic fiber kilns, as well as various specialized high-temperature furnaces, single crystal growth furnaces, sapphire growth furnaces, etc;
2. Molybdenum flat target, molybdenum round target, molybdenum tube target, tungsten and tungsten alloy tube target, new display (LCD) and glass power generation, thin film power generation coating materials, the only domestic full process production enterprise;
3. Various high-temperature molybdenum and molybdenum alloy products, as well as tungsten and tungsten alloy products.
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