Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting pictures & photos

Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

Condition New
Warranty 12 Months
Automatic Grade Automatic
Installation Vertical
Driven Type Electric
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Wafer Laser Scribing / Cutting
Feature 1 High Reliability and Stability
Feature 2 Sic Wafer Cutting
OEM/ODM Service Provided

Product Description

Product Description Product Features Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency Correction technology ensures high precision machining and consistency Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate Support ...

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Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Number of Employees 11
Year of Establishment 2019-09-12
Plant Area 83 square meters
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Wafer Laser Scribing / Cutting Ls Comparison

	Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting Contact Now	Quick View Hopo Electronics Inductance Process Equipment Wire Winding Single-Axis Winding Machine Contact Now	Quick View Hopo Electronics Thick Film Resistor Manufacturing Equipment Tapping Package Resistance Measuring Charter Machine Contact Now	Quick View Hopo Electronics Inductance Process Equipment Tapping Testing Test Packaging Machine Contact Now	Quick View Hopo Electronics Inductance Process Equipmenttantalum Capacitor Process Equipment Printing Tunnel Drying Oven Contact Now

Transaction Info
	Wafer Laser Scribing / Cutting Machine for Taiko Ring Cutting, Si/Sic Wafer Cutting Contact Now	Quick View Hopo Electronics Inductance Process Equipment Wire Winding Single-Axis Winding Machine Contact Now	Quick View Hopo Electronics Thick Film Resistor Manufacturing Equipment Tapping Package Resistance Measuring Charter Machine Contact Now	Quick View Hopo Electronics Inductance Process Equipment Tapping Testing Test Packaging Machine Contact Now	Quick View Hopo Electronics Inductance Process Equipmenttantalum Capacitor Process Equipment Printing Tunnel Drying Oven Contact Now
Price	US $ 100,000.00-1,000,000.00/ Piece	US $ 32100/ Piece	US $ 25700/ Piece	US $ 25400/ Piece	US $ 13600/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T	T/T	T/T	T/T
Quality Control
Product Certification	-	ISO, CE	ISO, CE	ISO, CE	ISO, CE
Management System Certification	-	ISO 9000	ISO 9000	ISO 9000	ISO 9000
Trade Capacity
Export Markets	Europe	Eastern Europe, Southeast Asia, Eastern Asia	Eastern Europe, Southeast Asia, Eastern Asia	Eastern Europe, Southeast Asia, Eastern Asia	Eastern Europe, Southeast Asia, Eastern Asia
Annual Export Revenue	-	-	-	-	-
Business Model	Others	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: 1-3 Month(s) Peak-season: 1-3 Month(s)	Off-season: 3-6 Month(s) Peak-season: 3-6 Month(s)	Off-season: 3-6 Month(s) Peak-season: 3-6 Month(s)	Off-season: 3-6 Month(s) Peak-season: 3-6 Month(s)	Off-season: 3-6 Month(s) Peak-season: 3-6 Month(s)
Product Attributes
Specification	Condition: New; Warranty: 12 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric; Product Name: Wafer Laser Scribing / Cutting; Feature 1: High Reliability and Stability; Feature 2: Sic Wafer Cutting; OEM/ODM Service: Provided;	After-sales Service: 24h7;* Function: Wire Winding; Demoulding: Automatic; Condition: New; Warranty: 24 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric; Mould Life: 300,000-1,000,000 Shots;	After-sales Service: 24h7;* Function: Measurement Kit; Demoulding: Automatic; Condition: New; Warranty: 24 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric; Mould Life: 300,000-1,000,000 Shots;	After-sales Service: 24h7;* Function: Measurement Kit; Demoulding: Automatic; Condition: New; Warranty: 24 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric; Mould Life: 300,000-1,000,000 Shots;	After-sales Service: 24h7;* Function: Drying; Demoulding: Automatic; Condition: New; Warranty: 24 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric; Mould Life: 300,000-1,000,000 Shots;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Anhui Hopo Automation Equipment Co.	Anhui Hopo Automation Equipment Co.	Anhui Hopo Automation Equipment Co.	Anhui Hopo Automation Equipment Co.
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