| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 6mil;
Min Drill: 0.15mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4high Tg Fr4,General Tg Fr4,Middle Tg Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Min.Line Width: 0.15mm;
Min.Hole Size: 0.1mm;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Layer: 1-24 Layers;
Copper Thickness: 0.5-6.0oz;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 16.7mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Digital Applications;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 60.7mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Power Amplifiers;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
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