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Multilayer Board PCB Design Process

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Price

Min. Order Reference FOB Price

1 Piece US$0.10 - 80.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL,ISO9001&ISO14001,SGS,RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-6mm
Copper Thickness 0.5-8oz

Product Description

Multilayer Board PCB Design Process ABIS CIRCUITS CO., LTD is a professional PCB company which is focus on double side, Multilayer and HDI pcb mass production. The company was established in 2006, We have two factories together (audited by UL,ISO9001/14001,SGS,RoHS report),And all products adhere ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Design Comparison

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Transaction Info
	Multilayer Board PCB Design Process Contact Now	PCBA Mcp23017 I2c Interface 16bit I/O Extension Module Pin Board Iic to Gipo Converter 25mA1 Drive Power Supply for and C51 Contact Now	Trusted Valued PCBA Factory Professional Engineering Support Bare PCB Manufacturing Chinese Xvideo Audio PCBA Contact Now	High Quality Good Customer Service Custom Electronic Assembly PCB PCBA Multilayer PCB Electronic Circuit Board Contact Now	Quick View Prototyping Printed Circuit Boards PCB Manufacturing with Shengyi Materials Contact Now
Price	US$0.10 - 80.00 / Piece	US$3.10 - 8.90 / Piece	US$3.10 - 8.90 / Piece	US$3.10 - 8.90 / Piece	US$0.10 - 10.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, D/P, PayPal, Western Union, Money Gram
Quality Control
Product Certification	UL,ISO9001&ISO14001,SGS,RoHS Report	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Rigid Circuit Board; Dielectric: Rogers; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	EXCEEDING ELECTRONICS GROUP LIMITED
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