| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Gold;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Min. SMD Size: 01005;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
Service: One-Stop Service;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.3mm;
Processing Technology: Electrolytic Foil;
Other Service: ODM, OEM, Final Product Assembling;
Insulation Materials: Organic Resin;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
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