BGA PCB Circuit Board Built on  4 Layer with Immersion Gold

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Copper Clad Laminate
  • Insulation Materials Epoxy Resin
  • Brand Bicheng
  • Transport Package Vacuum
  • Specification 210 X 100mm
  • Trademark Bicheng
  • Origin China

Product Description

General profile BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence name BGA. It's a type of surface-mount packaging used for integrated circuits(IC). ...

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Prototype Comparison
Transaction Info
Price US $ 9.99/ Piece US $ 0.10-1.00/ Piece US $ 0.5/ Piece US $ 0.10-5.00/ pieces US $ 0.10-5.00/ pieces
Min Order 1 Pieces 1 Pieces 1 Pieces 1 pieces 1 pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - ISO9001,ISO14001,ISO13485,Ts-16949,etc - ISO9001.ISO45001.Is014001 ISO9001, Is045001, Is014001
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million US$50 Million - US$100 Million US$1 Million - US$2.5 Million US$1 Million - US$2.5 Million
Business Model OEM, Own Brand(Bicheng) OEM, ODM OEM, ODM - -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 0.3-3oz;
Layer: 1 to 22;
Min. Hole Size: 0.2mm;
Min. Line Space: 3mil;
Min. Line Width: 3mil;
Test: Aoi;
Surface Finishing: Enig;
Solder Mask Type: Green;
Package: Vacuum Package;
Wrap and Twist: 5%;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ycx;
Copper Thickness: 0.3-60z;
Basematerial: Fr4 Any Specialized Material as Per Your Choice;
Range of Tg: 130-215c;
Min. Hole Size: 0.2mm;
Service: One Stop OEM Services;
Min.Line Spacing: 0.1mm;
MOQ: 1PC;
Layer Count: 1 to 28 Layers;
Twisting and Bending: 0.75%Min:0.5%;
Item: PCB&PCBA;
Silkscreen Colon: Black,Whitered Green;
Board Size: OEM;
Min.Line Width: 0.1 mm;
Board Thickness: 0.3mm-4mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum, as Your Require;
Copper Thickness: 0.3-6oz;
Min.Hole Size: 0.2 mm;
Range of Tg: 130-215c;
Service: One Stop OEM Services Provided;
Min.Line Spacing: 0.1 mm;
MOQ: 1PC;
Silkscreen Color: Blackwhite, Red, Green;
Board Size: OEM;
Min.Line Width: 0.1 mm;
Board Thickness: 0.3mm-6mm;
Surface Finishing: Lead/Lead-Free HASL, Enig, Silver, OSP;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Audited Supplier

Sichuan Concentric Circle Wisdom Technology Co., Ltd.

Diamond Member Audited Supplier

Sichuan Concentric Circle Wisdom Technology Co., Ltd.

Diamond Member Audited Supplier