VIP in Pad PCB  Built on 24 Layer with Panel Routing

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Copper Clad Laminate
  • Insulation Materials Epoxy Resin
  • Brand Bicheng
  • Transport Package Vacuum
  • Specification 210 X 220mm
  • Trademark Bicheng
  • Origin China

Product Description

General profile With the development of electronic products to light, thin and small, PCBs are also pushed into high density, high difficulty. Among them, via in pad is one of the topics that engineering designer can not avoid. It is a main part of multilayer PCBs and directly helps to save PCB ...

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Transaction Info
Price US$9.99 / Piece US$0.50 - 8.00 / pieces US$1.00 - 5.00 / pieces US$1.00 - 10.00 / pieces US$0.10 - 1.00 / Piece
Min Order 1 Piece 5 pieces 5 pieces 5 pieces 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T
Quality Control
Product Certification - - - - ISO9001,ISO14001,ISO13485,Ts-16949,etc
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
Modelnumbe: PCB;
PCB Cutting: Shear, V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/14 or Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm or 3mil;
Board Size: Custom;
Modelnumbe: PCB-8 Layer;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier