BGA PCB Circuit Board Built on  6 Layer with Impedance Controlled

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Copper Clad Laminate
  • Insulation Materials Epoxy Resin
  • Brand Bicheng
  • Transport Package Vacuum
  • Specification 210 X 100mm
  • Trademark Bicheng
  • Origin China

Product Description

General profile BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence name BGA. It's a type of surface-mount packaging used for integrated circuits(IC). ...

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Prototype Comparison
Transaction Info
Price US$9.99 / Piece US$0.99 - 20.00 / Piece US$8.00 - 20.00 / Piece US$0.99 - 20.00 / Piece US$0.10 - 2.20 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - - - - ISO/CQC/IATF/UL/RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Product Name: Fr4 Printed Circuit Board;
Layer: 1~20;
Finished Outer Copper Thickness: H/H0z-5/5oz;
Finished Inner Copper Thickness: H/H0z-4/4oz;
Min Board Size: 8*8mm;
Board Thickness: 0.3mm~3.5mm;
Max Board Size: 650*610mm;
Min Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver;
Value-Added Service: Layout;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier