| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20, 000, 000 Points Per Day;
DIP Capability: 300, 000 Points Per Day;
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Metal Coating: Stainless Steel;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Modle: Mr-30;
Air Supply: 0.5~0.7MPa;
Power Supply: AC220V, 1A, 100W;
Clean Liquid: Purified Water or Di Water;
Clean Time: 2~3min;
Day Time: 1~3min;
Jet Pressure: ≤0.4MPa;
Machine Weight: 35kg;
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Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Measurement Principle: Sine White Projection PMP Inspection;
Lens Resolution: 42mmx42mm (Based on 6. 5 M Pixel / 16.5um Resoluti;
Accuracy: Xy(Resolution):±1um;
Inspection Speed: 0.45 Sec/Fov;
Mark-Point Detection Time: 0.5sec/Piece;
Max.PCB Size: 510*460mm;
PCB Thickness: 0.3 ~ 6.0mm;
PCB Warpage: ±2.0mm;
PCB Weight: 4kg;
PCB Height: Top:50mm;
Conveyor Height: 900±20mm;
Conveyor Direction: L ~R or R ~L;
Power: AC220 50/60Hz,5A;
Compressed Air: 0.4 ~ 0.6MPa;
Weight: 1100kg;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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